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©
2012
congatec
AG
TCEDm10
20/94
3
Heatspreader
An important factor for each system integration is the thermal design. The heatspreader acts as a thermal coupling device to the module and
its aluminum plate is 4mm thick.
The heatspreader is thermally coupled to the CPU via a thermal gap filler and on some modules it may also be thermally coupled to other heat
generating components with the use of additional thermal gap fillers.
Although the heatspreader is the thermal interface where most of the heat generated by the module is dissipated, it is not to be considered as a
heatsink. It has been designed as a thermal interface between the module and the application specific thermal solution. The application specific
thermal solution may use heatsinks with fans, and/or heat pipes, which can be attached to the heatspreader. Some thermal solutions may also
require that the heatspreader is attached directly to the systems chassis thereby using the whole chassis as a heat dissipater.
For additional information about the conga-TCA heatspreader, refer to section 3.1 of this document.
Caution
There are mounting holes on the heatspreader designed to attach the heatspreader to the module. These mounting holes must be used to
ensure that all components that are required to make contact with heatspreader do so. Failure to utilize these mounting holes will result in
improper contact between these components and heatspreader thereby reducing heat dissipation efficiency.
Attention must be given to the mounting solution used to mount the heatspreader and module into the system chassis. Do not use a threaded
heatspreader together with threaded carrier board standoffs. The combination of the two threads may be staggered, which could lead to
stripping or cross-threading of the threads in either the standoffs of the heatspreader or carrier board.
Caution
When using PN: 047003 conga-TCA/D2550 and/or PN: 047004 conga-TCA/D2550 xHCI modules in conjunction with the conga-TCA/CSP-T(B)
passive cooling solution, active airflow must be provided over the cooling fins. The conga-TCA/CSP-T(B) is not capable of dissipating the heat
generated by these modules without an active airflow present.
