EGS3 Hardware Interface Description
Contents
EGS3_HD_v01.000a
Page 5 of 117
2009-08-12
Confidential / Released
Voiceband Transmit Path.................................................................... 96
Mounting EGS3 onto the Application Platform............................................... 101
6.2.1
Land Pattern and Stencil ................................................... 101
Board Level Characterization............................................ 102
Moisture Sensitivity Level ................................................................. 103
Soldering Conditions and Temperature ............................................ 103
6.2.3.1
Reflow Profile .................................................................... 103
Maximum Temperature and Duration................................ 104
Durability and Mechanical Handling.................................................. 105
6.2.4.1
Storage Life ....................................................................... 105
Processing Life.................................................................. 105
Baking ............................................................................... 105
Electrostatic Discharge...................................................... 105
Orientation......................................................................... 106
Barcode Label ................................................................... 107
Moisture Barrier Bag ......................................................... 108
Transportation Box ............................................................ 110
Reference Equipment for Type Approval....................................................... 113
Compliance with FCC and IC Rules and Regulations ................................... 114