Cinterion BGS2-E, Обзор аппаратуры

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BGS2-E/BGS2-W Hardware Interface Overview
5.5 Pad Assignment
26
BGS2_HIO_v01.300 Page 25 of 29 2011-03-08
Confidential / Released

Signal pads that are not used should not be connected to an external application.
Table 15:
Pad assignments
Pad no. Signal name Pad no. Signal name Pad no. Signal name
1
VMIC
23
Do not use
45 GND
2
EPN1
24
DSR0
46 GND
3
EPP1
25
DTR0
47 GND
4
GND
26
DCD0
48 GND
5
BATT+
27
GPIO9/I2CDAT
49 GND
6
GND
28
GPIO10/I2CCLK
50 GND
7
ADC1
29
TXD1
51 GND
8
ON
30
RXD1
52 GND
9
GND
31
RTS1
53
BATT+
10
VDIG
32
CTS1
54 GND
11
RXD0
33
EMERG_RST
55 GND
12
CTS0
34
GND
56 GND
13
TXD0
35
V180
57 GND
14
RING0
36
GPIO8
58 GND
15
RTS0
37
GPIO7/PWM1
59 RF_OUT
16 VDDLP 38 GPIO6/PWM2 60 GND
17
CCRST
39
GPIO5/LED
61 GND
18 CCIN 40 GPIO4 62 GND
19 CCIO 41 GPIO3 63 GND
20 CCVCC 42 GPIO2 64 AGND
21 CCCLK 43 GPIO1 65 MICP1
22
V285
44
GND
66 MICN1
67-107 GND
1
1. The pads 67-107 are located at the centre of the module and should be connected to Ground
except
for
pad 106 that is only required for factory tests. Pad 106 must not be connected to the external application,
but should be left open.