CareFusion Alaris 8600, Техническое и сервисное руководство

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5-1
Alaris
®
Auto-ID Module
Technical Service Manual
5.1 InTrOduCTIOn
This chapter describes how to disassemble
and reassemble the Auto-ID Module.
The circuit boards and surface mount
devices are not field repairable. Return
circuit boards to an authorized CareFusion
Service Center for repair. Attempting circuit
board repairs voids all warranties.
For replacement part information, see the
"Illustrated Parts Breakdown" chapter.
Following any level of maintenance, perform
the applicable tests, as identified in the
"Level of Testing Guidelines" table.
Due to product changes over time,
components/assemblies illustrated in this
chapter may differ from the instrument being
serviced.
5.2 dISaSSeMBly/reaSSeMBly
The disassembly procedures in this chapter
are presented in the most efficient sequence.
To reassemble, perform the steps in reverse
order.
Before adhering gaskets and labels to the
instrument, clean the surface with a cotton
swab or soft cloth lightly dampened with
70%
Isopropyl Alcohol.
warnInG
Disconnect the Auto-ID Module from the Alaris
®
System
prior to performing maintenance
.
The instrument case should only be opened
by qualified personnel using proper grounding
techniques.
CauTIOn
CMOS
devices are sensitive to static electrical
charges and may be damaged during repair if the
repair activity is not performed in an electrostatic
discharge (
ESD
) protected environment using
approved
ESD
protective procedures, including
personnel grounding.
CauTIOn
To avoid the risk of an electrical hazard or
damage to the instrument circuitry, do not spray
fluids directly onto the instrument or allow fluids to
enter the instrument.
Chapter 5 – Corrective Maintenance