CareFusion Alaris 8210 Series, Техническое и сервисное руководство

Страница: 17 / 56

Chapter 5 – CORRECTIVE MAINTENANCE
5-1 Alaris
®
SpO
2
Modules
Technical Service Manual
5.1 INTRODUCTION
This chapter describes how to disassemble
and reassemble the
S
p
O
2
Module.
The circuit boards used in the
S
p
O
2
Module
are fitted with surface mount devices and
are not field repairable. Return circuit
boards to an authorized CareFusion Service
Center for repair. Attempting circuit board
repairs voids all warranties.
For replacement part information, see the
"Illustrated Parts Breakdown" chapter.
Following any level of maintenance, perform
the applicable tests (see "Level of Testing
Guidelines" table).
Due to product changes over time,
components/assemblies illustrated in this
chapter may differ from the instrument being
serviced.
WARNING
Disconnect the
S
p
O
2
Module from the Alaris
®
System prior to performing maintenance .
The instrument case should only be opened
by qualified personnel using proper grounding
techniques.
CAUTION
CMOS
devices are sensitive to static electrical
charges and may be damaged during repair if the
repair activity is not performed in an electrostatic
discharge (
ESD
) protected environment using
approved
ESD
protective procedures, including
personnel grounding.