Manual-HotAir06-sdo-one-E
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Leaflet
The HotAir06 SDO ONE is a solder oven suit-
able for lead free solder processes using
SMD components.
The oven is working with full convection
forced air during the preheat process. After
entering the reflow stage powerful quartz
heaters are added to speed to solder temper-
ature within a short ramp.
Once the reflow set point is reached the lamp
power will be reduced to a minimum. At this
point 85% of the heating is performed by
forced hot air heater.
This unique feature makes the oven suitable
to solder big SMD components and/or com-
ponents with pads under their casing while
using lead free paste.
With good maintenance and proper use the
HotAir06 SDO ONE oven will serve your
solder needs for a long time with high quality solder results.
Some of the features include:
Outstanding reflow soldering quality for SMD and hybrid
Cures SMD adhesive
Two microprocessor controlled heat zones
Upon request, we can also supply bigger units and conveyorized units.
Technical Data
Power requirements
200 – 230 VAC. / 50-60Hz
Max. power consumption
3680W
Pre-heat zone
2180W
Reflow zone
1500W
Max. PCB substrate surface
300 x 370mm
Pre-heat time
1 – 999 sec.
Pre-heat temperature
60 -240 °C
Reflow time
1 – 999 sec.
Reflow temperature
100 – 290 °C
Heat up time
approx. 8 minutes
Net weight
+/- 22Kg
Options (not standard)
N2 inert gas connection with flow meter
All specifications are subject to change without notice.
Bungard Elektronik GmbH & Co. KG, Rilkestraße 1, 51570 Windeck – Germany
Tel.: +49 (0) 2292/9 28 28 - 0, Fax: +49 (0) 2292/9 28 28 - 29, E-mail: [email protected]
