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13
Problem
Cause
Corrective measures
Glue stick falls out of the
glue gun.
Glue stick diameter too small
Only use recommended original glue sticks
Adhesive continues to flow
or drip for a long time after
feed is stopped.
Melting point of glue stick is too low
Only use recommended original glue sticks
Set the correct processing temperature with the
temperature selection button
Glue gun drips constantly
without any pressure being
applied to the feed trigger.
Melting point of glue stick is too low
Only use recommended original glue sticks
Set the correct processing temperature with the
temperature selection button
Feed is sluggish.
Glue stick diameter is too large
and/or
melting point of glue stick is too low
Only use recommended original glue sticks
Set the correct processing temperature with the
temperature selection button
Feed is blocked by glue
leaking from the rear of the
glue stick.
Glue stick diameter is too small
and/or
melting point of glue stick is too low
Only use recommended original glue sticks
Set the correct processing temperature with the
temperature selection button
Adhesive does not flow
evenly.
Melting point of glue stick is too low
Only use recommended original glue sticks
Set the correct processing temperature with the
temperature selection button
Feed is not even
Press the feed trigger slowly and apply even pres-
sure
Bonding surface is only
holding fast in one place.
Glue has already partly cooled before the
components were pressed together
Press workpieces together faster
Apply adhesive in glue dots or lines instead of cover-
ing the whole surface
Pre-heat the bonding surface with a heat gun
Set the correct processing temperature
Bond becomes unstuck
after it cools.
Bonding surface is greasy or too smooth
Remove the grease from the bonding surface or
roughen it a little
Bonding surface is dusty
Clean the bonding surface
Workpiece material is not suitable
Hot melt adhesive is not suitable, use special adhes-
ive
Exposure to moisture
Only use in a dry environment
Ambient temperature too high/too low
Only use within the specified temperature range
Glued tiles in damp rooms
become unstuck.
Moisture is penetrating the bonding loca-
tion.
Hot melt adhesive is not suitable, use a cement-
based tile adhesive
Glued shoe soles are be-
coming unstuck.
Moisture expands leather and penetrates
the bonding location.
Hot melt adhesive is not suitable, use special adhes-
ive
"Threads" develop as the
glue gun is removed from
the bonding location after
applying adhesive.
Feed trigger is still pressed when the ap-
plication of adhesive is finished
Stop the feed just before finishing applying adhesive
Nozzle has not been wiped clean
At the end of gluing and before removing the glue
gun from the bonding location, wipe the nozzle
against the workpiece
Workpiece is melting.
Workpiece is made of a material with too
low a melting point, e.g. Styropor
®
.
Hot adhesive unsuitable
Use special adhesive (low-melt) and set the pro-
cessing temperature to 130 °C with the temperature
selection button
(9)
Fingers are being burned
while gluing.
Adhesive is puncturing paper when ap-
plied.
Do not hold the workpiece in your hands
Carry out gluing on a heatproof silicone mat
Adhesive is puncturing threads when ap-
plied.
Do not hold the workpiece in your hands
Carry out gluing on a heatproof silicone mat
Metal workpiece is heating up
Do not hold the workpiece in your hands
Bosch Power Tools
1 609 92A 6H1 | (22.04.2022)