Technical Specifications and Requirements
AW00136902000
22
Basler dart BCON
3.6.2
Heat Dissipation
You must provide sufficient heat dissipation to keep the operation temperature of the Basler dart
below the values indicated in Section 3.6.1 on
Since each installation is unique, Basler does not supply a strictly required technique for proper heat
dissipation. Instead, we provide the following general guidelines:
On all dart cameras, there are four holes at the corners of the camera board, designed for installing
the camera. You can also use the holes to dissipate heat.
Depending on the dart variant, different components are used to dissipate heat:
Basler bare board variants:
The metallic borders of the holes are designed to dissipate heat to connecting metallic
components.
Basler dart S-mount and CS-mount variants:
Rivets are placed in the four holes (see
). These rivets can be used to dissipate heat
towards connected metallic components.
Usage of the holes or rivets depends on your system design. In all cases, make sure that the holes
or rivets have contact to metallic components in your system. This way, the heat can dissipate
towards the metallic components.
Three examples
of how you can provide heat dissipation:
(a): The camera front touches a mounting plate. Heat dissipates via the rivets, the
camera front and the mounting plate.
(b): The camera rear side touches a mounting plate. Heat dissipates via the rivets
and the mounting plate.
The use of a fan to provide air flow over the camera is an efficient method of heat dissipation.
Fig. 16: Rivet at the Corner of the dart Camera Board
Heat dissipation
via the rivets
and the camera
front to the
mounting plate
Fig. 17: Heat Sink Examples
Heat sink
(dart CS-mount)
(
a
) (
b
)