Barco F70 Series, Руководство по обслуживанию

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Image 8-5
8.4 Thermal Sensors
The Projector is equipped with a range of thermal sensors. Temp sensors provide the thermal profile which
guides the fans to the optimal RPM with least possible audible noise. These are both bimetal and
thermocouple (P/N based) sensors, in order to have both immediate thermal shutdown (bimetal), and also as
a reading of the real time temperature. Master sensors are considered to be:
1. Air inlet
2. Air Outlet
A third key thermal sensor circuit is located on the main board ensure optimal thermal environment for the
FPGA (Arria).
See Thermal Management Diagram below for a complete schematic overview (Chapter 7.6.1).
8.5 DMD Cooling
The DMD chip is cooled by a thermoelectric system consisting of a heatsink and a liquid cooler system
transporting the heat to the radiator/fan area.
A heatsink is used to disperse the heat emitted by the illumination system and prevent the DLP® chip
absorbing too much heat. The heatsink is a heat pipe construction combined with a Peltier module. This
ensures that the DMD device operates within its recommended thermal envelope
A spring tensioned mechanism in the heatsink ensures adequate tension of the Peltier stud against the DMD
device for optimal heat dissipation.
Always renew the thermal paste on the stud when performing any service operation which
constitutes removing the Peltier/heatsink from the DMD device. Likewise, thermal phase change
material must be replaced if cooling pump is disconnected from heatsink.
Thermal management system