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2 Block Diagram and Features
This section summarizes the features of the development board, followed by functional descriptions.
2.1
List of Features
The following features are supported:
2.1.1
LTE System Board
M18QWG Global LTE SoC Module
Ambient Light Sensor
3-Axis Accelerometer
Temperature Sensor
USB Interface
60-pin High-density Expansion Connector (1.8V levels)
2x6 Peripheral Module Connector (3.3V levels)
Power Regulation
2.1.2
WNC M18QWG Global Module
Supports Global LTE bands 1/2/3/5/7/8/20/28/38/40
Cat-4 LTE (up to 150/50 Mbps Download/Upload)
2G/3G Fallback
GPS
Based on Qualcomm MDM9207
o
ARM® Cortex™ A7 Quad Core
o
One of the A7 cores is dedicated for User Application
Rich Peripheral Features
2.1.3
Pulse Electronics LTE + GNSS Antennas
Three antennas implemented as two foldable FPC antenna-assemblies
2G/3G/4G MIMO
GNSS (GPS, Glonass)
Antenna interface to the LTE System board is via three space-efficient U.FL connectors
2.1.4
Expansion Interfaces for System-Level Prototyping
Two interfaces facilitate the adding of custom hardware to the LTE System board:
System expansion interface
(1.8V I/O)
is a 60 pin expansion connector (Samtec ERF8 /
ERM8 series) on the underside of the system board. WNC module peripherals are accessible
via this interface at 1.8V signalling levels, if 3
.3V (or 2.5V) levels are required by the user’s
custom circuitry, then voltage translator devices must be added to the user’s board.
Pmod™-compatible interface
(3.3V I/O)
is 6x2 pin connector facilitates an easy to use
interface via I2C or SPI peripherals
, for access to a wide range of Pmod™ peripheral boards.
The relaxed pitch of this connector and low pin count of these interfaces also permits wiring-in
other 3.3V expansion boards (eg. MikroElektronika Click modules or Grove sensor boards) for
prototyping system-level solutions
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Страница 50: ...Page 50 Figure 19 Pulse FPC Antenna Options ...