ASROCK H670M-ITX/ax, Руководство пользователя

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1.2 Specifications
Platform •
Mini-ITX Form Factor
•
8 Layer PCB
CPU
•
Supports 12 th Gen Intel® Core TM Processors (LGA1700)
•
Digi Power design
•
8 Power Phase design
•
Supports Intel® Hybrid Technology
•
Supports Intel® Turbo Boost Max 3.0 Technology
Chipset
•
Intel® H670
Memory •
Dual Channel DDR4 Memory Technology
•
2 x DDR4 DIMM Slots
•
Supports DDR4 non-ECC, un-buffered memory up to
5000+(OC)*
* Supports DDR4 3200 natively.
* Please refer to Memory Support List on ASRock's website for
more information. (http://www.asrock.com/)
•
Supports ECC UDIMM memory modules (operate in non-
ECC mode)
•
Max. capacity of system memory: 64GB
•
Supports Intel® Extreme Memory Profile (XMP) 2.0
Expansion
Slot
•
1 x PCIe Gen5x16 Slot*
* Supports PCIe riser cards to extend one x16 slot to two x8 slots
* Supports NVMe SSD as boot disks
•
1 x Vertical M.2 Socket (Key E), supports type 2230 WiFi/BT
PCIe WiFi module and Intel® CNVi (Integrated WiFi/BT)
Graphics * Intel® UHD Graphics Built-in Visuals and the VGA outputs
can be supported only with processors which are GPU
integrated.
•
Intel® X
e
Graphics Architecture (Gen 12)
•
Dual graphics output: support HDMI and DisplayPort 1.4
ports by independent display controllers
•
Supports HDMI 2.1 TMDS Compatible with max. resolution
up to 4K x 2K (4096x2160) @ 60Hz