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R·I·T 

Title: ASML Stepper              

Semiconductor & Microsystems                           
Fabrication Laboratory 

RevisionB                            Rev Date: 12/21/2010

 

 

RIT SMFL 

 

Page 7 of 11 

6.4.8  Under Process Data you may adjust exposure energy, focus and tilt settings.  The 

minimum  energy  is  40mJ/cm

2

.    Under  Illumination  Mode  select  either 

conventional  or  annular.    Numerical  aperture  and  sigma  may  be  specified.    After 
changing any  of these values you must select the Apply button for the changes to 
take effect. 

 

6.4.9  The Clear button at the bottom of the screen will clear all of the entries and allow 

you to start over. 
 

6.4.10  The Run button will start the batch.  Wafers will automatically load, align, expose 

and unload. 

 

6.5

 

Unloading Wafers 
 
6.5.1

 

Lift the cover on the output cassette and remove the wafers.  Do not remove a carrier 
that is not fully raised

 

6.5.2  Place the empty cassette back on the tool.  All 4 stations should have a cassette. 

 

6.6 

Unloading Reticles 

 

6.6.1  To  remove  the  reticle  box  from  the  machine,  under  Main  Menu,  select Mat  Hdl 

from the top of the screen and then 3 – Exchange Reticle Box.  Click the Unlock 
button in the middle of the screen to unlock the reticle box. 

 
6.6.2  Remove the box by lifting straight up 2 cm, tilting the front up and moving it away 

from the stepper at a 45 degree angle.  Always support the reticle box on the bottom 
to prevent reticles from falling out

 
6.6.3  Carefully  open  the  reticle  box.   Unload the reticles.  Never touch the surface  of a 

reticle.  Close the reticle box and make sure it is secured before lifting. 

 
6.6.4  Replace the reticle box on the stepper by lowering it straight down without tilting it.  

The  open  side  of  the  internal  cassette  should  be  towards  the  stepper.    The  reticle 
box should be stored on the stepper when finished. 

 
6.6.5  Exit back to the Main Menu
 
 
 
 
 
 

Содержание PAS 5500

Страница 1: ...ment may result in loss of privileges 2 REFERENCE DOCUMENTS Batch Control PAS 5500 Training Module Reticle Design Manual PAS 5500 User Guide PAS 5500 Job Definition PAS Global Alignment Strategies PAS 5500 Steppers up to and including 300 Stepper Introduction 3 DEFINITIONS n a 4 TOOLS AND MATERIALS 4 1 General Description The ASML PAS 5500 200 is a 5x reduction i line stepper set up for exposure o...

Страница 2: ...nment Marks are aligned to the permanent fiducial marks F1 and F2 located on the fiducial plate on the wafer table 4 5 Wafer Zero Level The ASML Stepper utilizes zero level marks that are patterned and etched into the wafer before any other steps An etch depth of 1200A 10 allows the stepper to recognize the marks It is possible to pattern the zero level at the same time as the first level but over...

Страница 3: ... 5 1 1 The ASML uses ultraviolet light as well as lasers and should only be operated with all of the covers closed Safety glasses should be worn at all times 5 1 2 The ASML stepper had mechanical hazards Do not operate with open covers and do not open any covers during operation 5 2 Hazards to the Tool 5 2 1 Never open or service the wafer stage since serious damage to the tool can occur 5 2 2 Nev...

Страница 4: ...te 12 21 2010 RIT SMFL Page 4 of 11 6 INSTRUCTIONS 6 1 Starting the System 6 1 1 Swipe the tool in on the Card Swipe System 6 1 2 Verify that the computer is on 6 1 3 Make sure that the computer is on the Main Menu if not select 0 Exit Do not exit from the Main Menu Unload Load Reticle Changer ...

Страница 5: ... a 45 degree angle Always support the reticle box on the bottom to prevent reticles from falling out 6 2 3 Carefully open the reticle box The clear top is released from the base by sliding the 4 clamps underneath the base Load the reticles chrome side down with the pre alignment stars facing out Never touch the surface of a reticle Close the reticle box and make sure it is secured before lifting D...

Страница 6: ...rol and 1 Define Batch 6 4 2 The Batch ID is the name that you use to identify your wafers 6 4 3 The Job Name is the name of the stepper job that you want to use Click the Select button scroll down select the job and Accept at the top of the screen Writing a stepper job is detailed in a separate document 6 4 4 Click on the line to the right of Layer ID Select the Layer Number that you want to expo...

Страница 7: ...is not fully raised 6 5 2 Place the empty cassette back on the tool All 4 stations should have a cassette 6 6 Unloading Reticles 6 6 1 To remove the reticle box from the machine under Main Menu select Mat Hdl from the top of the screen and then 3 Exchange Reticle Box Click the Unlock button in the middle of the screen to unlock the reticle box 6 6 2 Remove the box by lifting straight up 2 cm tilti...

Страница 8: ...Process Data in your stepper job to enter a layer shift in microns See Section 6 8 of the ASML PASS 5500 Job Creation Manual 7 APPROPRIATE USES OF THE TOOL 7 1 No backside coated wafers only wafers with clean backs may be processed in this tool 7 2 No polyimide or SU8 may be processed in this tool 8 ATTACHMENTS 8 1 Dose to Clear Test Exposure Matrix 8 1 1 This test is done with or without a mask a...

Страница 9: ...he screen used to define a batch 8 2 FEM Focus Exposure Matrix 8 2 1 From the Main Menu select 6 Test Manage 8 2 2 Select 1 Run Test 8 2 3 Move to the top of the directory by clicking Up 8 2 4 Select Projection Systems 8 2 5 Select FEM Developer Customer 8 2 6 Select Accept at the top of the screen 8 2 7 Input desired values for matrix size energy increment focus and the number of die to be expose...

Страница 10: ...est Que 8 3 10 Select Select 8 3 11 Scroll down until you see daily RIT Characters are case sensitive 8 3 12 Select Accept at the top of the screen 8 3 13 Select Accept again and the test will run 8 3 14 Select Exit twice to return to the Main Menu 8 4 Procedure for Creating a Zero Level 8 4 1 Load the Combi Reticle 8 4 2 Select your stepper job 8 4 3 Select Layer ID 8 4 4 Select Zero Layer to exp...

Страница 11: ...rosystems Fabrication Laboratory Revision B Rev Date 12 21 2010 RIT SMFL Page 11 of 11 REVISION RECORD Summary of Changes Originator Rev Date Original Issue Sean O Brien A 07 20 2010 Clarified some of the instructions Sean O Brien B 12 21 2010 ...

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