Arbor Technology M1858C, Руководство пользователя

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Preface
• Connect the equipment into an outlet on a circuit different from that to
which the receiver is connected.
• Consult the dealer or an experienced radio/TV technician for help.
IEC 60601-1/EN60601-1/EN60601-1-2
• This product complies with the system standard IEC 60601-1 Medical
Electrical Equipment Part 1: General Requirements for Safety. And
therefore, the product is exclusively interconnected with IEC 60601-1
certified equipment in the patient environment.
• Equipment connected to the analog or digital interfaces of the unit must
comply with the respective IEC standards (e.g. IEC 60601-1 for medical
equipment). Furthermore all configurations shall comply with the current
version of the standard for SYSTEMS IEC 60601-1-1.
• Everybody who connects additional equipment to the signal input part
or signal output part configures a medical system, and is therefore
responsible that the system complies with current version of the
requirements of the system standard IEC 60601-1-1. If in doubt, consult the
technical service department or your local representative.
RoHS
ARBOR Technology Corp. certifies that all components in its products are
in compliance and conform to the European Union’s Restriction of Use
of Hazardous Substances in Electrical and Electronic Equipment (RoHS)
Directive 2002/95/EC.
The above mentioned directive was published on 2/13/2003. The main purpose
of the directive is to prohibit the use of lead, mercury, cadmium, hexavalent
chromium, polybrominated biphenyls (PBB), and polybrominated diphenyl
ethers (PBDE) in electrical and electronic products. Member states of the EU
are to enforce by 7/1/2006.
ARBOR Technology Corp. hereby states that the listed products do not contain
unintentional additions of lead, mercury, hex chrome, PBB or PBDB that
exceed a maximum concentration value of 0.1% by weight or for cadmium
exceed 0.01% by weight, per homogenous material. Homogenous material
is defined as a substance or mixture of substances with uniform composition
(such as solders, resins, plating, etc.). Lead-free solder is used for all
terminations (Sn(96-96.5%), Ag(3.0-3.5%) and Cu(0.5%)).