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UG-1444 

EVAL-ADHV4702-1CPZ 

User Guide 

 

Rev. 0 | Page 2 of 10 

TABLE OF CONTENTS 

Features .............................................................................................. 1

 

Evaluation Kit Contents ................................................................... 1

 

Documents Needed .......................................................................... 1

 

General Description ......................................................................... 1

 

EVAL-ADHV4702-1CPZ Photographs ......................................... 1

 

Revision History ............................................................................... 2

 

Evaluation Board Hardware ............................................................ 3

 

Board Stackup ............................................................................... 3

 

Initial Power-Up ........................................................................... 3

 

Power Supplies and Decoupling ................................................. 3

 

Input and Output .......................................................................... 3

 

Digital Ground (DGND) ............................................................. 3

 

Shutdown Feature (SDN Connector) .........................................4

 

Input Clamping Diodes ................................................................4

 

Input Guard Ring ..........................................................................4

 

Thermal Monitor/Flag (TMP) and Thermal Management .....4

 

Resistor Adjustable Quiescent Current (RADJ) ........................4

 

Evaluation Board Schematics...........................................................5

 

Ordering Information .......................................................................7

 

Bill of Materials ..............................................................................7

 

High Voltage Evaluation Board .......................................................9

 

Warnings, Restrictions, and Disclaimers ...................................9

 

 

REVISION HISTORY 

11/2018—Revision 0: Initial Version 

 

Содержание EVAL-ADHV4702-1CPZ

Страница 1: ...er area for attaching a heat sink to provide additional thermal management The evaluation board is a 6 layer board designed to minimize leakage currents with its guard ring feature It accepts Subminia ture Version A SMA and Subminiature Version B SMB edge mounted connectors on the inputs for easy connection to test equipment or other circuitry The ADHV4702 1 data sheet covers the specifications an...

Страница 2: ...ial Power Up 3 Power Supplies and Decoupling 3 Input and Output 3 Digital Ground DGND 3 Shutdown Feature SDN Connector 4 Input Clamping Diodes 4 Input Guard Ring 4 Thermal Monitor Flag TMP and Thermal Management 4 Resistor Adjustable Quiescent Current RADJ 4 Evaluation Board Schematics 5 Ordering Information 7 Bill of Materials 7 High Voltage Evaluation Board 9 Warnings Restrictions and Disclaimer...

Страница 3: ...ircuit can also provide a single supply of 220 V The schematic for the on board power management circuit is shown in Figure 5 For more information refer to the LT8304 1 data sheet for different voltage output options POWER SUPPLIES AND DECOUPLING The EVAL ADHV4702 1CPZ evaluation board can be powered using a single supply or dual supplies The total supply voltage VCC VEE must be between 24 V and 2...

Страница 4: ...e noninverting input by installing a 0 Ω resistor at R10 Remove the input clamping diodes D6 and D7 to ensure the complete enclosure of the high impedance input node THERMAL MONITOR FLAG TMP AND THERMAL MANAGEMENT The TMP pin can be used to monitor relative changes in die temperature The typical TMP pin voltage at room temperature is approximately 1 9 V and changes at approximately 4 5 mV C More p...

Страница 5: ...6 DNI R1210 TBD1210 R0603 0 TBD0603 5015 R1206 R1206 0 R1210 49 9 5015 R2512 142 0701 801 142 0701 801 C7 R26 INN_TP VCC A1 D7 D6 GND VEE D1 SDN VOUT P2 C3 C5 C4 C6 INP1 PWR R11 P3 GND1 RFB R12 R8 R23 R27 C1 R2 INN INN1 TMP RADJ RTEMP R1 R9 C9 RG R4 R7 R6 RCOMP RINN INN_TP1 CFB OUT R24 R25 CLOAD R10 R5 R3 INP_TP RINP INP CCOMP C2 INP_TP1 VEE GRD GRD1 VCC VCC VEE VEE SDN VMID VMID VCC VCC VEE VMID ...

Страница 6: ...0 R16 C20 R29 R30 R28 DS1 P6 VIN_15V P5 P4 P1 C19 C18 R22 R21 D4 D5 C17 C16 R13 T1 R20 R19 R18 R17 R15 R14 D3 D2 C12 C13 C15 C14 C11 U1 C10 C8 VIN_15V VEE_TRANSFORMER GND_TRANSFORMER VCC_TRANSFORMER AGND GND_TRANSFORMER VCC VCC_TRANSFORMER AGND AGND VEE VEE_TRANSFORMER N P A C 4 3 2 1 1 2 1 3 2 1 3 2 1 10 7 9 6 2 4 1 3 5 8 3 8 5 7 6 PAD 2 4 1 AGND AGND AGND PAD TC RREF RFB SW GND VIN INTVCC EN UVL...

Страница 7: ... Connector test point Components Corporation TP 104 01 00 18 2 INN INP Connector SMB Amphenol 142134 19 3 INN1 INP1 VOUT Connector SMA end launch Cinch Connectivity Solutions 142 0701 801 20 6 INN_TP INN_TP1 INP_TP INP_TP1 OUT TMP Connector test points Keystone Electronics 5015 21 3 P1 P4 SDN Connector PCB Berg header straight male 3 position Samtec TSW 103 08 G S 22 3 P2 P3 P5 Connector PCB Berg ...

Страница 8: ...umber 41 1 T1 Transformer Sumida 13324 T196 42 1 U1 LT8304 1 Analog Devices LT8304HS8E 1 PBF 43 1 VCC Connector PCB test point red Components Corporation TP 104 01 02 44 1 VEE Connector PCB test point blue Components Corporation TP104 01 06 45 1 VIN_15V Connector PCB test point white Components Corporation TP 104 01 09 ...

Страница 9: ...any property damage injury or death even if the evaluation board fails to perform as described or expected 4 You must properly dispose of or recycle the electronic components of the evaluation board to avoid injury to any other person Key Instructions It is important to operate this evaluation board within Analog Devices recommended specifications and environmental considerations per the user guid...

Страница 10: ...any other party for any reason Upon discontinuation of use of the Evaluation Board or termination of this Agreement Customer agrees to promptly return the Evaluation Board to ADI ADDITIONAL RESTRICTIONS Customer may not disassemble decompile or reverse engineer chips on the Evaluation Board Customer shall inform ADI of any occurred damages or any modifications or alterations it makes to the Evalua...

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