ADM-PCIE-KU3 User Manual
2.3 Thermal Performance
The ADM-PCIE-KU3 comes with a heat sink to reduce the heat of the FPGA which is typically the hottest point
on the card. The FPGA die temperature must remain under 100 degrees Celsius or the system monitor will clear
the FPGA design to ensure the card does not overheat. To calculate the FPGA die temperature, take your
application power and multiply by Theta JA from the chart below, and add your systems internal ambient
temperature. If you are using the fan provided with the board, you will find Theta JA is approximately 1.38 degC/
W for the board in still air.
The power dissipation of the FPGA can be estimated using the Xilinx Power Estimator (XPE) downloadable at
http://www.xilinx.com/products/technology/power/xpe.html. Download the UltraScale tool and set the Device to
Kintex UltraScale, XCKU060, FFVA1156, -2, Extended. Set the ambient temperature to your system ambient and
select User Override for the Effective Theta JA and enter the figure associated with your system LFM in the blank
field. Proceed to enter all applicable design elements and utilization in the following spreadsheet tabs. Next
acquire the KU3 power esitmator from Alpha Data by contacting [email protected]. You will then plug in
the FPGA power figures along with DDR4 and SFP usage to get an estimated board level power dissipation.
The graph below shows Theta JA of the board with two 3.5 watt QSFP loopback connectors inserted.
Figure 2 : Thermal Performance
Voltage
Source Name
Current Capability
0.95V
V VCC VCC_BRAM
22A
1.8
VCC VC VCCO_1.8V
3A
3.3
VCCO_3.3V
2.5A
1.5
VCCO_1.5V
7A
1.8
MGTVCCAUX
1A
1.0
MGTAVCC
5A
1.2
MGTAVTT
3A
Table 2 : Available Power By Rail
Page 3
PCB Information
ad-ug-1284_v1_13.pdf