ADM-PCIE-KU3 User Manual
2 PCB Information
2.1 Physical Specifications
The ADM-PCIE-KU3 complies with PCI Express CEM revision 3.0.
Description
Measure
Total Dy
68.9 mm
Total Dx (Inc. QSFP Cages)
174 mm
Total Dz
32.5 mm
Weight
220g
Table 1 : Mechanical Dimensions
2.2 Chassis Requirements
2.2.1 PCI Express
The ADM-PCIE-KU3 is capable of PCIe Gen 1/2/3 with 1/2/4/8/16 lanes, using the Xilinx Integrated Block for PCI
Express.
2.2.2 Mechanical Requirements
A 16-lane physical PCIe slot is required for mechanical compatibility.
Each ADM-PCIE-KU3 is shipped with a full height PCIe card bracket by default. If the application requires a
low-profile bracket, contact [email protected] before you place your order. Alpha Data will fit the
approrpiate bracket to suit either chassis type.
Because most PC chassis do not provide sufficient airflow to cool the FPGA, the ADM-PCIE-KU3 is shipped with
a fan on the heatsink. The fan is optional and can be easily removed with a Philips screw driver. The fan
consumes part of the adjacent PCIe slot, so the cards must have an unpopulated PCIe slot between them when
using the built-in fan. For larger quantities, Alpha-Data can remove the fan prior to shipping. Contact
[email protected] for details.
2.2.3 Power Requirements
The PCIe Specification permits a standard low-profile, half-length PCIe card to dissipate up to 25 W of power,
drawn from the PCIe slot. The ADM-PCIE-KU3 may consume more than 25 W of power for larger user FPGA
designs. Power estimation requires the use of the Xilinx XPE spreadsheet and/or a power estimator tool
available from Alpha Data. Please contact [email protected] to obtain this tool.
To save power, ensure that QSFP modules are only inserted if used and drive the SODIMMs into power down
mode (CKE low and RESET asserted):
Page 2
PCB Information
ad-ug-1284_v1_13.pdf
