FLEX I/O Digital Input and Output Modules w/ Diagnostics
5
Publication 1794-IN096C-EN-P - August 2015
ATTENTION:
FLEX™ I/O is grounded through the DIN rail to chassis ground.
Use zinc plated yellow-chromate steel DIN rail to assure proper grounding. The
use of other DIN rail materials (for example, aluminum or plastic) that can
corrode, oxidize, or are poor conductors, can result in improper or intermittent
grounding. Secure DIN rail to mounting surface approximately every 200 mm
(7.8 in.) and use end-anchors appropriately.
WARNING:
If you insert or remove the module while backplane power is on,
an electrical arc can occur. This could cause an explosion in hazardous
location installations. Be sure that power is removed or the area is
nonhazardous before proceeding.
