14
14
XP-ZR850
XP-ZR850
5-3. PRINTED WIRING BOARD – JACK BOARD (COMPONENT SIDE) –
:Uses unleaded solder.
• Semiconductor
Location
Ref. No.
Location
D401
H-8
D404
G-7
Q101
E-8
Q102
E-8
R102
C103
C102
C136
C161
CN602
CN603
L106
C145
C130
C129
C122
R115
R126
R120
R119
C126
C123
C128
C127
C116
C418
C414
CN901
L420
R471
L201
TH401
C403
FB405 FB404
S531
FB403
C406
C401
C201
C407
C502
C165
R501
VDR403
D401
C131
C408
R305
FB206
C210
D404
C133
C132
L107
Q102
C134
R118
R109
Q101
R114
R112
CT101
SL501
(OPEN)
C402
C146
L108
C423
C421
L414
L413
1
1
4
2
1
30
31
60
OPEN
1
V
W
U
4
M603
(SLED)
M
M602
(SPINDLE)
TP101
(RF (A) )
TP103
(RFGND (A) )
TP215
(TU_R )
TP217
(TU_L)
A
B
C
D
E
F
G
H
I
J
1
2
3
4
5
6
7
8
9
10
1-864-028-
(13)
13
JACK BOARD
(COMPONENT SIDE)
Содержание XP-ZR850
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