background image

C A U T I O N 

C A U T I O N ! 

SUBJECT TO ELECTROSTATIC DAMAGE

OR DECREASE IN RELIABILITY.

HANDLING PRECAUTIONS REQUIRED.

For more information, refer to the Installation and Maintenance Guide (P/N 61184561P4-5) 

available online at 

www.adtran.com

.

Warranty:

ADTRAN will replace or repair this product within the warranty period if it does not 

meet its published specifications or fails while in service. Warranty information can 

be found online at

 

www.adtran.com/warranty

.

©2010 ADTRAN, Inc. All Rights Reserved.

ADTRAN CUSTOMER CARE:

From within the U.S.     1.800.726.8663

From outside the U.S. +1 256.963.8716

PRICING AND AVAILABILITY  1.800.827.0807

*61184561P4-22C*

WARNING

!

The

 

Gigabit

 

Ethernet

 

port

 

is

 

classified

 

as

 

Type

 

2

 

or

 

Type

 

4,

 

as

defined

 

in

 

Appendix

 

B

 

of

 

GR

1089

CORE

 

Issue

 

4,

 

and

 

is

 

suitable

for

 

connection

 

to

 

intra

building

 

or

 

unexposed

 

wiring

 

or

 

cabling

only.

 

Do

 

not

 

metallically

 

connect

 

this

 

port

 

to

 

interfaces

 

which

connect

 

to

 

the

 

Outside

 

Plant

 

(OSP)

 

or

 

to

 

the

 

OSP

 

wiring.

 

The

Gigabit

 

Ethernet

 

port

 

is

 

designed

 

for

 

use

 

as

 

an

 

intrabuilding

interface

 

only

 

(Type

 

2

 

or

 

Type

 

4

 

ports

 

as

 

described

 

in

 

GR

1089

CORE

 

Issue

 

4)

 

and

 

requires

 

isolation

 

from

 

exposed

 

OSP

 

cabling.

The

 

addition

 

of

 

Primary

 

Protectors

 

is

 

not

 

sufficient

 

protection

 

in

order

 

to

 

connect

 

this

 

interface

 

metallically

 

to

 

OSP

 

wiring.

 

The

Gigabit

 

Ethernet

 

port

 

is

 

suitable

 

for

 

connection

 

only

 

to

 

shielded

intra

building

 

cabling

 

grounded

 

at

 

both

 

ends.

CAUTION

!

♦  

Per

 

GR

1089

CORE

 

the

 

ADTRAN

 

system

 

that

 

the

 

SFP

 

is

 

being

deployed

 

in

 

is

 

designed

 

and

 

intended

 

for

 

installation

 

as

 

part

 

of

a

 

Common

 

Bonding

 

Network

 

(CBN).

 

The

 

ADTRAN

 

system

that

 

the

 

SFP

 

is

 

being

 

deployed

 

in

 

is

 

not

 

designed

 

nor

 

intended

for

 

installation

 

as

 

part

 

of

 

an

 

Isolated

 

Bonding

 

Network

 

(IBN).

♦  

Per

 

GR

1089

CORE

 

Section

 

9,

 

the

 

SFPGC

 

does

 

not

 

have

 

an

internal

 

DC

 

connection

 

between

 

battery

 

return

 

and

 

frame

ground.

 

The

 

SFPGC

 

can

 

be

 

installed

 

in

 

a

 

DC

I

 

(isolated)

 

or

 

DC

C

 

(common)

 

installation.

 

For

 

installations

 

where

 

other

 

cards

 

or

the

 

host

 

system

 

have

 

internal

 

connections

 

between

 

battery

return

 

and

 

frame

 

ground,

 

the

 

system

 

would

 

be

 

intended

 

for

deployment

 

only

 

in

 

a

 

DC

C

 

installation.

♦  

The

 

ADTRAN

 

system

 

chassis

 

frame

 

ground

 

terminal

 

must

 

be

connected

 

to

 

an

 

earth

 

ground

 

to

 

ensure

 

that

 

the

 

metal

enclosure

 

of

 

the

 

SFPGC

 

is

 

properly

 

grounded

 

via

 

the

backplane

 

connector.

The

 

SFPGC

 

is

 

designed

 

to

 

meet

 

the

 

following

 

environmental

 

classes:

ETSI

 

EN

 

300

 

019

1

1

 

“Classification

 

of

 

environmental

 

conditions;

 

Storage,”

 

Class

 

1.2

ETSI

 

EN

 

300

 

019

1

2

 

“Classification

 

of

 

environmental

 

conditions,

 

Transportation,”

 

Class

 

2.3

ETSI

 

EN

 

300

 

019

1

3

 

“Classification

 

of

 

environmental

 

conditions,

 

Stationary

 

use

 

at

 

weather

protected

 

locations,”

 

Class

 

3.3

The

 

equipment

 

is

 

designed

 

to

 

function

 

without

 

degradation

 

during

 

exposure

 

to

 

all

 

test

 

severities

 

per

 

Class

 

3.3.

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