A
CHI
®
6
The parameters of
IR-PRO
BGA Rework Station
Basic Parameters
Heating
Upper Dark
IR /
Bottom
IR
Dimension
L 475mm
mm
mm
Weight
27kg
Total weight
About 29 kg, vary with the differen need of the
users
Electrical Parameters
Power
220V AC
Upper Heating
Dark
IR
Size of Upper heating
80mm
80mm
Consumption of upper heating 400W
Bottom Heating
IR
Size of Bottom heating
260 mm
mm
Consumption
of
Bottom
heating
2000W
General power
2500W
Temperature Control
Control mode of Upper
PLC programmable logic controller,
precision ± 0.5%, Alarm
Control mode of Bottom
Iindependent
temperature
control,
high-precision
closed-loop control, precision ± 0.5%, NO Alarm
Rework Function
SMD
Suit for welding,remove or repair packaged devices
such as BGA,PBGA,CSP,multi-layer substrates
EMI metallic shield product and solder/lead free
Rework
welding
Size of
applicable
chips
70mm
70 mm
Size of
applicable
PCB
400mm
mm
