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SERVICE MANUAL
HAMAMATSU, JAPAN
1,387K-2101
Printed in Japan 2002.03
PA
011626
CONTENTS
SPECIFICATIONS .............................................................................. 3
PANEL LAYOUT .................................................................................. 7
CIRCUIT BOARD LAYOUT & WIRING
.......................................................................................................... 10
DIMENSIONS .................................................................................... 11
BLOCK & LEVEL DIAGRAM ............................................................. 12
DISASSEMBLY PROCEDURE ......................................................... 14
LSI PIN DESCRIPTION .................................................................... 20
IC BLOCK DIAGRAM ........................................................................ 22
CIRCUIT BOARDS ........................................................................... 23
INSPECTION .................................................................................... 33
OVERALL CIRCUIT DIAGRAM
PARTS LIST
EMX66M
This document is printed on chlorine free (ECF) paper with soy ink.
• OPTION
RK-88 RACK MOUNT KIT
EMX66M 20020325-75000
RK88 20020325-2500
本资料由OKXIA视听皮带资源库www.okxia.cn提供
Summary of Contents for EMX66M
Page 5: ...5 EMX66M...
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Page 26: ...26 EMX66M A A MIX66 Circuit Board...
Page 27: ...27 EMX66M A A Pattern side 3NA V826690 1...
Page 28: ...28 EMX66M to MIX66 CN901 DSP Circuit Board Component side 3NA V826710 1...
Page 29: ...29 EMX66M Pattern side 3NA V826710 1...
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