© 2018 NXP B.V.
FRDM-KW36 Minimum BoM Development
Board
User’s Guide
1. Introduction
This guide describes the hardware of KW36 Minimum Bill
of Material development board (
reference X-UBluetooth
LEKWZ0-31417
). The board is configurable, low-power,
and cost-effective. It is an evaluation and development
board for application prototyping and demonstration of the
KW36A/35A and KW36Z/35Z family of devices.
The KW36 is an ultra-low-power, highly integrated single-
chip device that enables Bluetooth® Low Energy
(Bluetooth LE) or Generic FSK (at 250, 500 and 1000
kbps) for portable, extremely low-power embedded
systems.
The KW36 integrates a radio transceiver operating in
2.36 GHz to 2.48 GHz range supporting a range of GFSK,
an Arm® Cortex®-M0+ CPU, up to 512 KB Flash and up
to 64 KB SRAM. Bluetooth LE Link Layer hardware and
peripherals optimized to meet the requirements of the target
applications
.
KW36 device is also available on the FRDM-KW36
Freedom Development Board. For more information about
the FRDM-KW36 Freedom Development Board, see the
NXP Semiconductor
Document Number: MiniBoMKW36UG
User’s Guide
Rev. 0 , 09/20187
Contents
1.
Introduction ....................................................................... 1
2
Overview and description .................................................. 2
2.1
Overview .................................................................2
2.2
Feature description ..................................................3
3
Functional description........................................................ 5
3.1
Block diagram .........................................................5
3.2
Generic application schematic .................................6
3.3
RF Circuit ................................................................9
3.4
Clocks ......................................................................9
3.5
Power management ................................................ 10
3.6
User Application LEDs .......................................... 15
4
I/O .................................................................................... 16
4.1
I/O pin accessibility ............................................... 16
5
Schematic......................................................................... 18
6
Layout .............................................................................. 19
7
PCB ................................................................................. 20
8
Mounted PCB .................................................................. 20
9
Component positioning .................................................... 21
10
Bill of material ................................................................. 23
Buck mode ............................................................. 23
Bypass mode .......................................................... 25
11
References ....................................................................... 27
12
Revision history ............................................................... 27
