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EL-MF877-00                                                 Page  1 
Template Revision A 

 

 

  

  

Pr oduct End-of-Life Disassembly Instr uctions

 

Product Category: Notebooks and Tablet PCs

 

Marketing Name / Model 
[List multiple models if applicable.] 

6545b/Tag 15.6'' 

Name / Model #2   

Name / Model #3  

Name / Model #4   

Name / Model #5  

Purpose: 

The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions 

for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU 
directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE). 

1.0

 

Items Requiring Selective Treatment

 

1.1 Items listed below are classified as requiring selective treatment. 
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as 
applicable. 

Item Description 

Notes 

Quantity 
of items 
included 
in product

 

Printed Circuit Boards (PCB) or Printed Circuit 
Assemblies (PCA) 

With a surface greater than 10 sq cm 
Mother board 

Batteries 

All types including standard alkaline and lithium coin 
or button style batteries   battery and RTC battery 

Mercury-containing components 

For example, mercury in lamps, display backlights, 
scanner lamps, switches, batteries             

           

Liquid Crystal Displays (LCD) with a surface greater 
than 100 sq cm 

Includes background illuminated displays with gas 
discharge lamps  LCD 

Cathode Ray Tubes (CRT) 

            

           

Capacitors / condensers (Containing PCB/PCT) 

            

           

Electrolytic Capacitors / Condensers measuring 
greater than 2.5 cm in diameter or height 

            

           

External electrical cables and cords 

            

           

Gas Discharge Lamps 

            

           

Plastics containing Brominated Flame Retardants 

            

           

Components and parts containing toner and ink, 
including liquids, semi-liquids (gel/paste) and toner 

Include the cartridges, print heads, tubes, vent 
chambers, and service stations.             

           

Components and waste containing asbestos 

            

           

Components, parts and materials containing 
refractory ceramic fibers 

            

           

Components, parts and materials containing 
radioactive substances 

            

           

Summary of Contents for ProBook 6545b - Notebook PC

Page 1: ...ircuit Boards PCB or Printed Circuit Assemblies PCA With a surface greater than 10 sq cm Mother board 1 Batteries All types including standard alkaline and lithium coin or button style batteries battery and RTC battery 2 Mercury containing components For example mercury in lamps display backlights scanner lamps switches batteries Liquid Crystal Displays LCD with a surface greater than 100 sq cm In...

Page 2: ... Remove HDD door 6 Remove HDD module 7 Remove ODD assembly 8 Remove Keyboard 9 Remove strip cover with power button PCB caps lock PCB 10 Remove LCD cable and antenna connector 11 Divide LCD assembly from base assembly 12 Remove palm rest sub assembly 13 Remove TP module RTC battery 14 Divide logic up assembly w buttons from base assembly 15 Divide small PCB from base assembly 16 Remove speaker 17 ...

Page 3: ...EL MF877 00 Page 3 Template Revision A Step1 Remove Battery module Step2 Remove Mini card door Step3 Remove Ram door Step4 Remove Blue tooth door Step5 Remove HDD door Step6 Remove HDD module ...

Page 4: ...EL MF877 00 Page 4 Template Revision A Step7 Remove ODD assembly Step8 Remove Keyboard Step9 Remove strip cover Step10 11 Remove LCD cable and antenna connector Divide LCD assembly from base assembly ...

Page 5: ...vision A Step12 Remove palm rest sub assembly Step13 Remove TP module RTC battery Step14 Divide logic up assembly w buttons Step15 Divide small PCB from base assembly from base assembly Step16 Remove speaker Step17 Remove fan module ...

Page 6: ... Revision A Step18 Divide MB w thermal module from base assembly Step19 Divide RS232 PCB RJ11 from lower sub assy Step20 Divide thermal module ODD trans PCB Step21 22 Divide LCD cover LCD bezel Divide LCD panel and Hinge Bracket ...

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