LPM2100 bg NB Module Hardware Usage Guide
Shanghai Yuge Information Technology Co., Ltd.
- 38 -
Figure 7-1 Reflow soldering temperature graph
Table 7-1 Reflow process parameter table
Warm zone
Time
key parameter
Preheating zone
(
40
℃~
165
℃)
Heating rate
:
1
℃
/s
~
3
℃
/s
Temperature zone
(
160
℃~
210
℃)
(t1
~
t2)
:
70s
~
120s
Recirculation zone
(
> 217
℃)
(t3
~
t4)
:
40s
~
60s
Peak temperature
:
235
℃~
245
℃
Cooling zone
Cooling rate
:
2
°
C/s
≤
Slope
≤
5
°
C/s