LPM2100 bg NB Module Hardware Usage Guide
Shanghai Yuge Information Technology Co., Ltd.
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Chapter 7. Production and packaging
7.1 Chapter overview
Module packaging and storage
Production welding.
7.2 Module packaging and storage
The LPM2100 bg series modules are packaged in trays and packaged in vacuum-sealed
bags. The 1000PCS is shipped in a vacuum sealed bag.
The storage of the LPM2100 bg series module module is subject to the following
conditions
：
The module has a moisture sensitivity rating of 3 levels.
When the ambient temperature is greater than 40 degrees Celsius and the air humidity is
less than 90%, the module can be stored in a vacuum sealed bag for 12 months.
When the vacuum sealed bag is opened, if the ambient temperature of the module is
lower than 30 degrees Celsius and the air humidity is less than 60%, the factory can
complete the patch within 72 hours, and the module can directly perform reflow soldering
or other high temperature process.
If the module is in other conditions, it needs to be baked before the patch.
If the module needs to be baked, please remove the module and bake it for 8 hours at 125
degrees Celsius (allowing fluctuations of up to 5 degrees Celsius)
。
7.3 Production welding
The LPM2100 bg series modules are packaged in anti-static trays. The SMT line needs
to be equipped with a Tray module. It is recommended to use a reflow oven above 7
temperature zones
；
To ensure the quality of the module paste, the thickness of the stencil corresponding to
the pad portion of the LPM2100 bg series module is recommended to be 0.18mm.
The recommended reflow temperature is 235~245oC, which cannot exceed 260oC.
When the PCB is laid out on both sides, the LCC module layout must be machined on the
2nd side. Avoid module falling parts, welding and welding, and poor internal welding of
the module caused by the gravity of the module.
The recommended furnace temperature curve is shown below
：
