A
B
C
D
E
F
G
H
1
2
3
4
5
6
RP-U200
■
PRINTED CIRCUIT BOARD (Foil side)
E-33/J-31
E-32/J-30
DSP P.C.B.
(Surface Mount Device)
5
5 A
B
1
16
17
32
1
7
8
14
1
4
5
8
1
4
5
8
Point
t
-A (CH1 : Emitter of Q416)
Point
t
-B (CH2 : Collector of Q419)
V : 5V/div (CH1), V : 2V/div (CH2)
DC, 1 : 1 probe, H : 5 sec/div
CH1
CH2
AC CORD ON
AC CORD OFF
Ref. No.
Location
D401
C3
D402
C3
D403
D3
D404
C5
D405
D3
D406
C5
D407
D4
D408
D4
D411
D5
D412
D5
D429
C3
D430
C3
D431
B3
D432
B3
D433
B3
D434
B3
D435
B4
D436
B4
D501
C4
Ref. No.
Location
IC445
D2
IC447
C5
IC470
D3
IC479
C4
●
Semiconductor Location
Ref. No.
Location
Q406
C2
Q407
C2
Q408
C2
Q409
C3
Q412
C2
Q413
B2
Q414
B2
Q415
B2
Q416
C3
Q419
B3
Q423
C3
Q425
C3
NOTE)
The DSP P.C.B. actually has a four-layer pattern structure (part face pattern, internal pattern
1, internal pattern 2 and solder face pattern) but it is shown as "part face p solder
face pattern" in this diagram.
NOTE)
DSP P.C.B.は、4層パターン構造(部品面パターン、内層1パターン、内層2パターン、ハンダ面パ
ターン)ですが、本図のDSP P.C.B.は、部品面パターン+ハンダ面パターンを表記しております。