XCPC-9200
5
Versions of the XCPC-9200
The conduction cooled version of the XCPC-9200 module uses a custom
conduction cooled assembly consisting of a conduction cooled frame, thermo bars,
ejector/injectors and Wedge-Loks
®
designed to thermally conduct heat away from
the conduction-cooled PMC modules per ANSI/VITA 30.1-2001. In a conduction-
cooled assembly, adequate thermal conduction must be provided to prevent a
temperature rise above the maximum operating temperature. This version of the
XCPC-9200 is design for use in an ATR type chassis.
The XCPC-9200 is also available in an extended temperature version which uses a
standard CompactPCI 6U front panel shown in Fig. 2-2.
The air cooled XCPC-9200 requires adequate air circulation (200 to 300LFM) to
prevent a temperature rise above the maximum operating temperature and to
prolong the life of the electronics. If the installation is in an industrial environment
and the board is exposed to environmental air, careful consideration should be
given to air filtering.
