500-004941-000
5-1
SECTION 5
CONFIGURATION AND INSTALLATION
5.1
UNPACKING PROCEDURES
CAUTION
SOME OF THE COMPONENTS ASSEMBLED ON VMIC’S PRODUCTS MAY BE
SENSITIVE TO ELECTROSTATIC DISCHARGE AND DAMAGE MAY OCCUR ON
BOARDS THAT ARE SUBJECTED TO A HIGH ENERGY ELECTROSTATIC FIELD.
UNUSED BOARDS SHOULD BE STORED IN THE SAME PROTECTIVE BOXES IN
WHICH THEY WERE SHIPPED. WHEN THE BOARD IS TO BE LAID ON A BENCH
FOR CONFIGURING, ETC., IT IS SUGGESTED THAT CONDUCTIVE MATERIAL BE
INSERTED UNDER THE BOARD TO PROVIDE A CONDUCTIVE SHUNT.
Upon receipt, any precautions found in the shipping container should be
observed. All items should be carefully unpacked and thoroughly inspected for
damage that might have occurred during shipment. The board(s) should be
checked for broken components, damaged printed-circuit board(s), heat damage,
and other visible contamination. All claims arising from shipping damage should be
filed with the carrier and a complete report sent to VMIC together with a request
for advice concerning disposition of the damaged item(s).
5.2
PHYSICAL INSTALLATION
WARNING
DO NOT INSTALL OR REMOVE BOARDS WHILE POWER IS APPLIED.
De-energize the equipment and insert the board into an appropriate slot
of the chassis, while ensuring that the card is properly aligned and oriented in the
supporting card guides. Slide the card smoothly forward against the mating
connector until firmly seated.
5.3
JUMPER AND SWITCH LOCATIONS
Refer to Figure 5.3-1 for locations of all jumpers and switches.
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