TSOP572.., TSOP574..
www.vishay.com
Vishay Semiconductors
Rev. 1.8, 27-Feb-15
7
Document Number: 82434
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
ASSEMBLY INSTRUCTIONS
Reflow Soldering
• Reflow soldering must be done within 168 h while stored
under a max. temperature of 30 °C, 60 % RH after
opening the dry pack envelope
• Set the furnace temperatures for pre-heating and heating
in accordance with the reflow temperature profile as
shown in the diagram. Exercise extreme care to keep the
maximum temperature below 260 °C. The temperature
shown in the profile means the temperature at the device
surface. Since there is a temperature difference between
the component and the circuit board, it should be verified
that the temperature of the device is accurately being
measured
• Handling after reflow should be done only after the work
surface has been cooled off
Manual Soldering
• Use a soldering iron of 25 W or less. Adjust the
temperature of the soldering iron below 300 °C
• Finish soldering within 3 s
• Handle products only after the temperature has cooled off
VISHAY LEAD (Pb)-FREE REFLOW SOLDER PROFILE
Note
(1)
MOQ: minimum order quantity
ORDERING INFORMATION
ORDERING CODE
PACKAGING
VOLUME
(1)
REMARKS
TSOP57..TT1
Tape and reel
MOQ: 1800 pcs
3.95 mm x 3.95 mm x 0.75 mm
TSOP57..TT2
MOQ: 7000 pcs
0
50
100
150
200
250
300
0
50
100
150
200
250
300
t (s)
T (°C)
255 °C
240 °C
245 °C
max. 260 °C
max. 120 s
max. 100 s
217 °C
max. 20 s
max. Ramp Up 3 °C/s
max. Ramp Down 6 °C/s
max. 2 cycles allowed
19800
