Thermal Considerations
VL-EPU-4460 Reference Manual
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The system power dissipation is primarily dependent on the application program; that is, its use
of computing or I/O resources. The stress levels used in this testing are at the top of the range of
a typical user’s needs.
Test Results
Test Scenario 1: Dual Core EPU-4460-EAP + HDW-416 Heat Sink, with/without HDW-415 fan
The thermal characterization for the EPU-4460-EAP model (Intel Core i3) is shown below.
Figure 27. EPU-4460-EAP Dual Core Temperature Relative to Ambient Temperature
