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Thermal Considerations
VL-EPU-3311 Reference Manual
65
The recommended method is to attach the Osprey heat plate to the mounting plate (VL-HDW-
405), and attach the mounting plate to the enclosure.
A thermal interface compound must be applied to the heat plate to thermally bond it to the
mounting plate or other surface to which the Osprey is mounted. Spread the compound thinly
and evenly across the entire heat plate surface before mounting. The compound is supplied in
the VL-CKR-BB11 cable kit or sold separately as part number VL-HDW-401.
Heat Plate Up
Use this assembly method if you are adding a heatsink to the standard Osprey heat plate. Figure
35 (a representative image of a similar VersaLogic product) shows the assembly including the
optional HDW-405 mounting plate and optional HDW-406 heatsink.
Figure 35. Hardware Assembly with Heat Plate Up
The recommended assembly method for this configuration is as follows:
1.
Attach the heatsink to the Osprey heat plate.
2.
Attach the baseboard to the mounting plate (VL-HDW-405) with standoffs.
3.
Attach the mounting plate to the enclosure.