Ublox TIM-5H, Hardware Integration Manual

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TIM-5H - Hardware Integration Manual Contents
GPS.G5-MS5-07015-A-1 u-blox proprietary Page 6
your position is our focus
2.9.2 Active Antenna ........................................................................................................................... 23
2.9.3 Active Antenna Bias Power.......................................................................................................... 24
2.9.4 Active Antenna Supervisor........................................................................................................... 24
3 Product Handling........................................................................................................28
3.1 Packaging........................................................................................................................................... 28
3.1.1 Reels ........................................................................................................................................... 28
3.1.2 Tapes .......................................................................................................................................... 29
3.2 Shipment, Storage and Handling ........................................................................................................ 29
3.2.1 Handling ..................................................................................................................................... 29
3.2.2 Shipment..................................................................................................................................... 29
3.2.3 Storage ....................................................................................................................................... 30
3.2.4 Handling ..................................................................................................................................... 30
3.2.5 Floor Life ..................................................................................................................................... 31
3.3 Processing .......................................................................................................................................... 32
3.3.1 Moisture Preconditioning ............................................................................................................ 32
3.3.2 Soldering Paste............................................................................................................................ 32
3.3.3 Reflow Soldering ......................................................................................................................... 33
3.3.4 Optical Inspection........................................................................................................................ 34
3.3.5 Cleaning...................................................................................................................................... 35
3.3.6 Repeated Reflow Soldering.......................................................................................................... 35
3.3.7 Wave Soldering ........................................................................................................................... 35
3.3.8 Hand Soldering ........................................................................................................................... 35
3.3.9 Rework........................................................................................................................................ 35
3.3.10 Conformal Coating ..................................................................................................................... 36
3.3.11 Casting........................................................................................................................................ 36
3.3.12 Grounding Metal Covers ............................................................................................................. 36
3.3.13 Use of Ultrasonic Processes.......................................................................................................... 36
4 Product Testing...........................................................................................................37
4.1 u-blox In-Series Production Test .......................................................................................................... 37
4.2 Test Parameters for OEM Manufacturer .............................................................................................. 37
4.3 System Sensitivity Test ........................................................................................................................ 38
4.3.1 Guidelines for Sensitivity Tests ..................................................................................................... 38
4.3.2 ‘Go/No go’ tests for integrated devices........................................................................................ 38
Appendix ..........................................................................................................................39
A Migration to u-blox 5 receivers .................................................................................39