ODIN-W2 series - System integration manual
UBX-14040040 - R20
Handling and soldering
Page 33 of 43
C1-Public
4.3.5
Repeated reflow soldering
Only a single reflow soldering process is encouraged for boards with a module populated on it. The
reason for this is the risk of the ODIN-W2 module falling off due to high weight in relation to the
adhesive properties of the solder or the mated RF coaxial cable.
4.3.6
Wave soldering
Boards with combined through-hole technology (THT) components and surface-mount technology
(SMT) devices require wave soldering to solder the THT components. Only a single wave soldering
process is encouraged for boards populated with the modules.
4.3.7
Hand soldering
Hand soldering is not recommended.
4.3.8
Rework
Rework is not recommended.
☞
Never attempt a rework on the module itself; for example, replacing individual components. Such
actions immediately terminate the warranty.
4.3.9
Conformal coating
Certain applications employ a conformal coating of the PCB using HumiSeal® or other related coating
products.
These materials affect the HF properties of the modules and it is important to prevent them from
flowing into the module. The RF shields do not provide protection for the module from coating liquids
with low viscosity, therefore care is required while applying the coating.
☞
Conformal coating of the module will void the warranty
4.3.10
Casting
If casting is required, use viscose or another type of silicon pottant. The OEM is strongly advised to
qualify such processes in combination with the modules before implementing this in the production.
☞
Casting will void the warranty.
4.3.11
Grounding metal covers
Attempts to improve grounding by soldering ground cables, wick or other forms of metal strips
directly onto the EMI covers is done at the customer’s own risk. The numerous ground pins should be
sufficient to provide optimum immunity to interferences and noise.
☞
u-blox gives no warranty for damages to the modules caused by soldering metal cables or any
other forms of metal strips directly onto the EMI covers.
4.3.12
Use of ultrasonic processes
The short range modules contain components that are sensitive to ultrasonic waves. Use of any
ultrasonic processes (cleaning, welding and son) may cause damage to the module.
☞
u-blox gives no warranty against damages to the modules caused by any ultrasonic processes.
