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LEA-M8S / LEA-M8T - Hardware integration manual 

UBX-15030060 - R06 

   

Page 4 of 33 

Production information 

Contents 

 

3.3

 

Hardware migration LEA-6T -> LEA-M8T ...........................................................................................21

 

3.4

 

Software migration ...................................................................................................................................21

 

4

 

Product handling ................................................................................................................................. 22

 

4.1

 

Packaging, shipping, storage and moisture preconditioning ..........................................................22

 

4.2

 

Soldering .....................................................................................................................................................22

 

4.3

 

EOS/ESD/EMI precautions ......................................................................................................................25

 

4.4

 

Applications with cellular modules ........................................................................................................28

 

Appendix ....................................................................................................................................................... 30

 

A

 

Glossary ................................................................................................................................................. 30

 

B

 

Recommended parts ......................................................................................................................... 30

 

Related documents ................................................................................................................................... 32

 

Revision history .......................................................................................................................................... 32

 

Contact .......................................................................................................................................................... 33

 

 

Summary of Contents for LEA-M8S

Page 1: ...S LEA M8T u blox M8 concurrent GNSS modules Hardware integration manual Abstract This document describes the features and specifications of u blox LEA M8S and LEA M8T modules www u blox com UBX 150300...

Page 2: ...Document contains the final product specification This document applies to the following products Product name Type number Firmware version PCN reference LEA M8S LEA M8S 0 10 ROM SPG 3 01 UBX 1601275...

Page 3: ...ESET_N Reset 8 1 5 2 EXTINT External interrupt 8 1 5 3 SAFEBOOT_N 8 1 5 4 D_SEL Interface select LEA M8T only 9 1 5 5 Antenna open circuit detection ANT_DET_N 9 1 5 6 TIMEPULSE 9 1 5 7 TIMEPULSE 2 LEA...

Page 4: ...tion LEA 6T LEA M8T 21 3 4 Software migration 21 4 Product handling 22 4 1 Packaging shipping storage and moisture preconditioning 22 4 2 Soldering 22 4 3 EOS ESD EMI precautions 25 4 4 Applications w...

Page 5: ...supply pins VCC V_BCKP and VDD_USB 1 3 1 VCC Main supply voltage The VCC pin provides the main supply voltage During operation the current drawn by the module can vary by some orders of magnitude esp...

Page 6: ...ailable to provide antenna bias voltage to supply an optional external active antenna For more information see section 2 4 If not used connect the V_ANT pin to GND 1 4 Interfaces 1 4 1 UART The LEA M8...

Page 7: ...down to a voltage of 3 3 V Almost no current requirement 1 mA C23 C24 Capacitors Required according to the specification of LDO U1 D2 Protection diodes Protect circuit from overvoltage ESD when conne...

Page 8: ...e RTC time is also reset but not BBR 1 5 2 EXTINT External interrupt EXTINT0 and EXTINT1 are external interrupt pins with fixed input voltage thresholds with respect to VCC see the LEA M8S Data sheet...

Page 9: ...ULSE 2 LEA M8T only A configurable TIMEPULSE2 signal is available on LEA M8T module only For more information see the u blox 8 u blox M8 Receiver Description Including Protocol Specification 3 1 6 Ele...

Page 10: ...LEA M8S LEA M8T Hardware integration manual UBX 15030060 R06 Hardware description Page 10 of 33 Production information Figure 3 EMI Precautions...

Page 11: ...a bias voltage Connect to GND or leave open if passive antenna is used If an active antenna is used add a 10 resistor in front of V_ANT input to the antenna bias voltage or VCC_RF EXTINT1 20 I Ext int...

Page 12: ...open I Interface select D_SEL 0 SPI D_SEL 1 or open DDC Reserved 9 21 22 23 Reserved Leave open Table 2 Pinout LEA M8S LEA M8T 2 1 1 Pin name changes Selected pin names have been updated to agree wit...

Page 13: ...3 Footprint and paste mask Figure 5 describes the footprint and provides recommendations for the paste mask for the LEA M8S and LEA M8T modules These are recommendations only and not specifications N...

Page 14: ...gn with passive antenna A design using a passive antenna requires more attention to the layout of the RF section Typically a passive antenna is located near electronic components therefore take care t...

Page 15: ..._RF output can be used to supply the LNA with a filtered supply voltage A standard GNSS LNA has enough bandwidth to amplify GPS Galileo GLONASS and BeiDou signals 2 4 2 Active antenna design Active an...

Page 16: ...nally powered active antenna This circuit has to be used if the active antenna has a different supply voltage than the VCC_RF for example if a 5 V active antenna is used Figure 10 Active antenna desig...

Page 17: ...t detection antenna supervisor If a suitably dimensioned R_BIAS series resistor is placed in front of the V_ANT pin a short circuit can be detected in the antenna supply The detection happens inside t...

Page 18: ...y should be free of noise Usually low frequency analog noise is less critical than digital noise of spurious frequencies with harmonics up to the GPS QZSS band of 1 575 GHz GLONASS band of 1 602 GHz a...

Page 19: ...ment During design in do not place the module near sources of heating or cooling The receiver oscillator is sensitive to sudden changes in ambient temperature which can adversely impact satellite sign...

Page 20: ...ck No difference 3 TxD Serial port TXD Serial port No difference 4 RxD Serial port RXD Serial port No difference 5 NC Not connected Reserved Not connected No difference 6 VCC Supply voltage VCC Supply...

Page 21: ...u blox 6 module OK to do the same in M8 12 Reserved Safeboot_N TP2 SAFEBOOT _N Safeboot_N Time pulse 2 Must not be held LO during start up 13 GND Ground GND Ground No difference 14 GND Ground GND Grou...

Page 22: ...the solder joints on the connectors half vias must meet the appropriate IPC specification Reflow soldering A convection type soldering oven is highly recommended over the infrared type radiation oven...

Page 23: ...ng the u blox M8 module consider an optical inspection step to check whether The module is properly aligned and centered over the pads All pads are properly soldered No excess solder has created conta...

Page 24: ...ering for example pins 1 and 15 and continue from left to right Rework The u blox M8 module can be unsoldered from the baseboard using a hot air gun When using a hot air gun for unsoldering the module...

Page 25: ...cost effective solutions To avoid overstress damage during production or in the field it is essential to observe strict EOS ESD EMI handling and protection measures To prevent overstress damage at th...

Page 26: ...module ESD protection measures GNSS positioning modules are sensitive to electrostatic discharge ESD Special precautions are required when handling For more robust designs employ additional ESD prote...

Page 27: ...gure 16 EOS and ESD precautions Electromagnetic interference EMI Electromagnetic interference EMI is the addition or coupling of energy causing a spontaneous reset of the GNSS receiver or resulting in...

Page 28: ...If such isolation cannot be achieved for example in the case of an integrated cellular GNSS antenna an additional input filter is needed on the GNSS side to block the high energy emitted by the GSM t...

Page 29: ...band interference is caused by signal frequencies that are different from the GNSS carrier see Figure 19 The main sources are wireless communication systems such as cellular CDMA WCDMA Wi Fi BT and s...

Page 30: ...data sheet basis only Other components may also be used Manufacturer Part ID Remarks Parameters to consider Diode ON Semiconductor ESD9R3 3ST5G Standoff voltage 3 3 V Low capacitance 0 5 pF ESD9L3 3ST...

Page 31: ...lithic type For data signals 34 pF load capacitance NFA18SL307V1A45 Array type For data signals 4 circuits in 1 package Feed through capacitor Murata NFM18PC NFM21P 0603 2A 0805 4A Rs 0 5 Resistor 10...

Page 32: ...regular updates to u blox documentation and to receive product change notifications register on our homepage www u blox com Revision history Revision Date Name Comments R01 12 Feb 2016 jfur Objective...

Page 33: ...p u blox com Regional Office China Beijing Phone 86 10 68 133 545 E mail info_cn u blox com Support support_cn u blox com Regional Office China Chongqing Phone 86 23 6815 1588 E mail info_cn u blox co...

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