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NINA-B1 series - System Integration Manual 

UBX-15026175 - R06

 

 

Product testing 

 

 

Page 41 of 48

 

6

 

Product testing 

6.1

 

u-blox In-Series production test 

u-blox focuses on high quality for its products. All units produced are fully tested automatically in production 
line. Stringent quality control process has been implemented in the production line. Defective units are analyzed 
in detail to improve the production quality. 
This is achieved with automatic test equipment (ATE) in production line, which logs all production and 
measurement data. A detailed test report for each unit can be generated from the system. Figure 15 illustrates 
typical automatic test equipment (ATE) in a production line. 
The following tests are performed as part of the production tests: 

 

Digital self-test (firmware download, MAC address programming) 

 

Measurement of voltages and currents 

 

Functional tests  

 

Digital I/O tests 

 

Measurement of RF characteristics in all supported bands (such as receiver RSSI calibration, frequency 
tuning of reference clock, calibration of transmitter power levels and so on.) 

 

Figure 15: Automatic test equipment for module test 

6.2

 

OEM manufacturer production test 

As the testing is already done by u-blox, an OEM manufacturer does not need to repeat firmware tests or 
measurement of the module’s RF performance or tests over analog and digital interfaces in their production test. 
However, an OEM manufacturer should focus on: 

 

Module assembly on the device; it should be verified that: 

o

 

Soldering and handling process did not damage the module components 

o

 

All module pins are well soldered on device board 

o

 

There are no short circuits between pins 

 

Component assembly on the device; it should be verified that: 

o

 

Communication with host controller can be established 

o

 

The interfaces between module and device are working 

o

 

Overall RF performance test of the device including antenna 

Dedicated tests can be implemented to check the device. For example, the measurement of module current 
consumption when set in a specified state can detect a short circuit if compared with a “Golden Device” result.  

Summary of Contents for NINA-B1 Series

Page 1: ...stand alone Bluetooth low energy modules With embedded Bluetooth low energy profiles and services these modules are tailored for OEMs who wish to embed their own application on top of the available B...

Page 2: ...os and designs described herein may in whole or in part be subject to intellectual property rights Reproduction use modification or disclosure to third parties of this document or any part thereof wit...

Page 3: ...1 4 1 Module reset 11 1 4 2 Internal temperature sensor 11 1 5 Debug Serial Wire Debug SWD 11 1 6 Serial interfaces 12 1 6 1 Universal Asynchronous Serial Interface UART 12 1 6 2 Serial Peripheral In...

Page 4: ...General considerations for schematic design and PCB floor planning 35 3 6 2 Module placement 35 3 6 3 Layout and manufacturing 35 3 7 Module footprint and paste mask 35 3 8 Thermal guidelines 36 3 9 E...

Page 5: ...ation to run on the built in Cortex M4F With 512 kB flash and 64 kB RAM it offers the best in class capacity for customer applications running on top of the Bluetooth low energy stack using SDK from N...

Page 6: ...own application developed with either ARM mbed Nordic SDK or Wirepas development environment inside the NINA B1 module The different software options are described in more detail in section 2 1 2 Pin...

Page 7: ...op view The grey pins in the center of the modules are GND pins The outline of NINA B111 ends at the dotted line as shown in Figure 2 where the antenna area of NINA B112 begins All digital or analog f...

Page 8: ...an NFC field to the NFC pins when they are configured as GPIOs Doing so may cause permanent damage to the module When driving different logic levels on these pins in GPIO mode a small current leakage...

Page 9: ...rounding SWITCH_1 and SWITCH_2 during a reset and holding it low for 10s will make the module restore all factory settings GPIO_16 16 P0 28 I O General purpose I O Pin is analog capable UART_DTR Can b...

Page 10: ...ain supply input The NINA B1 series uses an integrated DC DC converter to transform the supply voltage presented at the VCC pin into a stable system core voltage Due to this the NINA B1 modules are co...

Page 11: ...iciency at extremely light loads a typical DC DC efficiency quickly degrades as idle current drops below a few mA greatly reducing the battery life Due to the low current consumption and wide voltage...

Page 12: ...nect and or toggle connectable status Enable disable the rest of the UART interface Enter wake up from the sleep mode See the NINA B1 series Data Sheet 2 for characteristic information about the UART...

Page 13: ...t Event trigger Interrupt event trigger to the software application Wake up event Any ADC input 8 10 12 bit analog to digital converter Any analog Analog comparator input Compare two voltages capable...

Page 14: ...gh a 50 transmission line to allow reception of radio frequency RF signals in the 2 4 GHz frequency band Choose an antenna with optimal radiating characteristics for the best electrical performance an...

Page 15: ...ional emission levels produced by the end product The module may be integrated with other antennas In this case the OEM installer must certify his design with respective regulatory agencies 1 8 2 Inte...

Page 16: ...connectivity software The u blox connectivity software enables the use of the Bluetooth Low Energy functions controlled by AT commands over the UART interface Examples of supported features are u blo...

Page 17: ...l it automatically e Read the information in the SDK Release Notes and check the nRF5 Software Development Kit documentation available at http infocenter nordicsemi com Nordic tools More information a...

Page 18: ...fine BUTTONS_ACTIVE_STATE 0 define BUTTONS_LIST BUTTON_1 BUTTON_2 define BSP_BUTTON_0 BUTTON_1 define BSP_BUTTON_1 BUTTON_2 define RX_PIN_NUMBER 5 define TX_PIN_NUMBER 6 define CTS_PIN_NUMBER 7 define...

Page 19: ...bed CLI is the name of the ARM mbed command line tool which enables the full mbed workflow such as repositories version control maintaining dependencies updating from remotely hosted repositories GitH...

Page 20: ...inNames h file should declare and define a couple of enumerations to configure the custom pin mapping Figure 6 and Figure 7 show the contents of the PinNames h file in the case of EVK NINA B1 ifndef M...

Page 21: ...clude cmsis h ifdef __cplusplus extern C endif typedef enum PIN_INPUT PIN_OUTPUT PinDirection define PORT_SHIFT 3 typedef enum nRF52 pin names p0 0 p1 1 p2 2 p3 3 p4 4 p5 5 p6 6 p7 7 p8 8 p9 9 p10 10...

Page 22: ...VK NINA B1 board LED1 NINA_B1_GPIO_1 Red LED2 NINA_B1_GPIO_7 Green SW1 LED3 NINA_B1_GPIO_8 Blue LED4 NC SW1 NINA_B1_GPIO_7 SW2 NINA_B1_GPIO_18 D0 NINA_B1_GPIO_23 D1 NINA_B1_GPIO_22 D2 NINA_B1_GPIO_21...

Page 23: ...ng of u blox connectivity software is normally done over UART If the flash is erased or any other software is flashed on the NINA B1 module then the SoftDevice and the u blox bootloader must be flashe...

Page 24: ...contains the bootloader and SoftDevice 3 Set the correct COM port and the desired speed and click Update button 4 The module will then reboot into the bootloader and the flashing will start A command...

Page 25: ...contains the application Keep in mind that the bootloader will time out and resume the application after 10 seconds Flashing must have started before the time out and resuming of the application 2 3 2...

Page 26: ...x hex When developing and flashing applications based on the Nordic SDK it is recommended to do an Erase all to remove the u blox connectivity software and its stored parameters before flashing down t...

Page 27: ...ng the Bluetooth device address When the new u blox connectivity software is flashed to the module it is important to restore the Bluetooth device address as well Step 1 To enable writing of the Bluet...

Page 28: ...and output pins Accurate design is required to guarantee that the voltage level is well defined during module boot 6 Other pins Accurate design is required to guarantee proper functionality 3 2 Anten...

Page 29: ...minimized to reduce dielectric losses o If traces longer than few centimeters are needed it is recommended to use a coaxial connector and cable to reduce losses o Stack up should allow for thick 50 tr...

Page 30: ...o Internal integrated antennas imply physical restriction to the PCB design Integrated antenna excites RF currents on its counterpoise typically the PCB ground plane of the device that becomes part o...

Page 31: ...Select antennas that provide appropriate gain figure that is combined antenna directivity and efficiency figure so that the electromagnetic field radiation intensity does not exceed the regulatory lim...

Page 32: ...igned by an antenna manufacturer providing the best possible return loss or VSWR Provide a ground plane large enough according to the related integrated antenna requirements The ground plane of the ap...

Page 33: ...C connection must be routed through a PCB area separated from sensitive analog signals and sensitive functional units It is a good practice to interpose at least one layer of PCB ground between VCC tr...

Page 34: ...capacitor value is given by the below equations An antenna inductance of Lant 2 H will give tuning capacitors in the range of 130 pF on each pin For good performance match the total capacitance on NF...

Page 35: ...nal quality Verify the recommended maximum signal skew for differential pairs and length matching of buses Minimize the routing length longer traces will degrade signal performance Ensure that maximum...

Page 36: ...a the antenna port can be separated from the enclosure port The antenna port includes the antenna element and its interconnecting cable surfaces The applicability of ESD immunity test to the whole dev...

Page 37: ...ocal GND and PCB GND Before mounting an antenna patch connect ground of the device When handling the RF pin do not come into contact with any charged capacitors and be careful when contacting material...

Page 38: ...cycles 1 Table 11 Recommended reflow profile Figure 14 Reflow profile Lower value of TP and slower ramp down rate 2 3 C sec is preferred After reflow soldering optical inspection of the modules is re...

Page 39: ...r boards populated with the modules Miniature Wave Selective Solder process is preferred over traditional wave soldering process Hand soldering is not recommended Rework is not recommended Conformal c...

Page 40: ...NINA B1 series System Integration Manual UBX 15026175 R06 Qualifications and approvals Page 40 of 48 5 Qualifications and approvals For regulatory information see the NINA B1 series Datasheet 2...

Page 41: ...such as receiver RSSI calibration frequency tuning of reference clock calibration of transmitter power levels and so on Figure 15 Automatic test equipment for module test 6 2 OEM manufacturer product...

Page 42: ...ormed after establishing a connection with an external device A very simple test can be performed by just scanning for a known Bluetooth low energy device and checking the signal level These kinds of...

Page 43: ...try Canada I2 C Inter Integrated Circuit LDO Low Drop Out LED Light Emitting Diode MAC Media Access Control MSL Moisture Sensitivity Level NSMD Non Solder Mask Defined PCB Printed Circuit Board RF Rad...

Page 44: ...d parts for antenna matching PCB layout must be identical to the one provided by u blox please implement one of the reference designs included in this section or contact u blox The designer must use t...

Page 45: ...Should have a solid GND inner layer under and around the RF components vias and small openings are allowed 4 RF trace Antenna coplanar microstrip matched to 50 5 GND trace Green Minimum required top...

Page 46: ...race required around the RF trace and pins GND stitching vias should be used around the RF trace to ensure a proper GND connection No other components are allowed within this area The solid GND layer...

Page 47: ...nology equipment Safety Part 1 General requirements 12 FCC Regulatory Information Title 47 Telecommunication 13 JESD51 Overview of methodology for thermal testing of single semiconductor devices 14 No...

Page 48: ...m Regional Office China Beijing Phone 86 10 68 133 545 E mail info_cn u blox com Support support_cn u blox com Regional Office China Chongqing Phone 86 23 6815 1588 E mail info_cn u blox com Support s...

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