NEO-M8U - Hardware Integration Manual
UBX-15016700 - R07
Contents
Page 3 of 28
Production Information
Contents
Document Information ................................................................................................................................ 2
Contents .......................................................................................................................................................... 3
1
Hardware description ........................................................................................................................... 5
1.1
Overview ........................................................................................................................................................ 5
1.2
Configuration ............................................................................................................................................... 5
1.3
Connecting power ....................................................................................................................................... 5
1.3.1
VCC: Main supply voltage ................................................................................................................. 5
1.3.2
V_BCKP: Backup supply voltage ...................................................................................................... 5
1.3.3
VDD_USB: USB interface power supply ......................................................................................... 6
1.3.4
VCC_RF: Output voltage RF ............................................................................................................. 6
1.4
Interfaces ...................................................................................................................................................... 6
1.4.1
UART ..................................................................................................................................................... 6
1.4.2
USB ........................................................................................................................................................ 6
1.4.3
Display Data Channel (DDC) ............................................................................................................. 7
1.4.4
SPI .......................................................................................................................................................... 7
1.4.5
TX Ready signal ................................................................................................................................... 8
1.5
I/O pins ........................................................................................................................................................... 8
1.5.1
Electromagnetic interference on I/O lines ..................................................................................... 8
2
Design ..................................................................................................................................................... 10
2.1
Pin description ........................................................................................................................................... 10
2.1.1
Pin name changes............................................................................................................................. 11
2.2
Minimal design........................................................................................................................................... 11
2.3
Layout: Footprint and paste mask ........................................................................................................ 11
12
2.4
Antenna ....................................................................................................................................................... 12
2.4.1
Antenna design with passive antenna ......................................................................................... 12
2.4.2
Active antenna design ..................................................................................................................... 13
3
Untethered Dead Reckoning ........................................................................................................... 15
3.1
Implementation ......................................................................................................................................... 15
3.2
Installation .................................................................................................................................................. 15
3.3
Initialization and Calibration ................................................................................................................... 15
4
Migration from NEO-M8L to NEO-M8U ...................................................................................... 16
4.1
Hardware migration NEO-M8L to NEO-M8U ...................................................................................... 16
5
Product handling ................................................................................................................................. 17
5.1
Packaging, shipping, storage and moisture preconditioning .......................................................... 17
5.2
Soldering ..................................................................................................................................................... 17
5.3
EOS/ESD/EMI precautions ...................................................................................................................... 20
5.4
Applications with cellular modules ........................................................................................................ 23
Appendix ....................................................................................................................................................... 25
A
Glossary ................................................................................................................................................. 25
