NEO-D9C - Integration manual
4.7.3.2 Footprint
Figure 30: NEO-D9C suggested footprint (i.e. copper mask)
4.7.3.3 Paste mask
Figure 31: NEO-D9C suggested paste mask
To improve the wetting of the half vias, reduce the amount of solder paste under the module and
increase the volume outside of the module by defining the dimensions of the paste mask to form a
T-shape (or equivalent) extending beyond the copper mask.
4.7.4 Layout guidance
The presented layout guidance reduces the risk of performance issues at design level.
4.7.4.1 RF In trace
The RF In trace has to work in the combined QZSS L2 + L6 signal band.
UBX-21031631 - R02
4 Design
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