NEO-D9C - Integration manual
High temperature drift and air vents can affect the GNSS performance. For best
performance, avoid high temperature drift and air vents near the receiver.
4.7.3 Package footprint, copper and paste mask
Copper and solder mask dimensioning recommendations for the NEO-D9C module packages are
provided in this section.
The module edge pads are 0.8 mm x 0.9 mm. Implement a pad size on your PCB as a copper
pad size of 0.8 mm x 1.8 mm. Solder mask for the same pad is 0.9 mm x 1.9 mm. Paste
mask for the same pad is 0.8 mm x 2.1 mm.
These are recommendations only and not specifications. Consider the paste mask outline
when defining the minimal distance to the next component. The exact copper, solder and
paste mask geometries, distances, stencil thickness and solder paste volumes must be
adapted to the specific production processes (e.g. soldering etc.) of the customer.
4.7.3.1 Mechanical dimensions
Figure 29: NEO-D9C mechanical dimensions
UBX-21031631 - R02
4 Design
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