NINA-B1 series - System Integration Manual
UBX-15026175 - R06
System description
Page 15 of 48
impact the return loss seen at the antenna port. Matching components are often required to re-tune the
antenna to bring the return loss within an acceptable range.
It is difficult to predict the actual matching values for the antenna in the final form factor. Therefore, it is a good
practice to have a placeholder in the circuit with a ”pi” network, with two shunt components and a series
component in the middle, to allow maximum flexibility while tuning the matching to the antenna feed.
1.8.1.2
Approved antenna designs
NINA-B1 modules come with a pre-certified design that can be used to save costs and time during the
certification process. To take advantage of this service, the customer is required to implement antenna layout
according to u-blox reference designs. The reference design is described in
Appendix B
The designer integrating a u-blox reference design into an end-product is solely responsible for the unintentional
emission levels produced by the end-product.
The module may be integrated with other antennas. In this case, the OEM installer must certify his design with
respective regulatory agencies.
1.8.2
Integrated antenna – NINA-B112
The NINA-B112 is equipped with an integrated antenna on the module for simpler integration.
1.8.3
NFC antenna
The NINA-B1 series modules include a Near Field Communication interface, capable of operating as a 13.56 MHz
NFC tag at a bit rate of 106 kbps. As an NFC tag, data can be read from or written to the NINA-B1 modules
using an NFC reader; however the NINA-B1 modules are not capable of reading other tags or initiating NFC
communications. Two pins are available for connecting to an external NFC antenna:
NFC1
and
NFC2
.Reserved
pins (RSVD)
Do not connect reserved (
RSVD
) pin. The reserved pins can be allocated for future interfaces and functionality.
1.9
GND pins
Good connection of the module's GND pins with solid ground layer of the host application board is required for
correct RF performance. It significantly reduces EMC issues and provides a thermal heat sink for the module.
See the Module footprint and paste mask and Thermal guidelines sections for information about ground design.
