NINA-B1 series - System Integration Manual
UBX-15026175 - R06
Design-in
Page 35 of 48
One exception is represented by High Impedance traces (such as signals driven by weak pull
resistors) that may be affected by crosstalk. For those traces, a supplementary isolation of 4w from
other busses is recommended.
3.6.1
General considerations for schematic design and PCB floor-planning
•
Verify which signal bus requires termination and add series resistor terminations to the schematics.
•
Carefully consider the placement of the module with respect to antenna position and host processor.
•
Verify with PCB manufacturer allowable stack-ups and controlled impedance dimensioning.
•
Verify that the power supply design and power sequence are compliant with NINA-B1 series module
specification (refer to section 1.3).
3.6.2
Module placement
•
Accessory parts like bypass capacitors should be placed as close as possible to the module to improve
filtering capability, prioritizing the placement of the smallest size capacitor close to module pads.
Particular care should be taken not to place components close to the antenna area. The
designer should carefully follow the recommendations from the antenna manufacturer about the
distance of the antenna vs. other parts of the system. The designer should also maximize the distance
of the antenna to Hi-frequency busses like DDRs and related components or consider an optional
metal shield to reduce interferences that could be picked up by the antenna thus reducing the
module’s sensitivity.
•
An optimized module placement allows better RF performance. See Antenna interfaces section for more
information on antenna consideration during module placement.
3.6.3
Layout and manufacturing
•
Avoid stubs on high speed signals. Even through-hole vias may have an impact on signal quality.
•
Verify the recommended maximum signal skew for differential pairs and length matching of buses.
•
Minimize the routing length; longer traces will degrade signal performance. Ensure that maximum
allowable length for high speed busses is not exceeded.
•
Ensure that you track your impedance matched traces. Consult with your PCB manufacturer early in the
project for proper stack-up definition.
•
RF and digital sections should be clearly separated on the board.
•
Ground splitting is not allowed below the module.
•
Minimize bus length to reduce potential EMI issues from digital busses.
•
All traces (including low speed or DC traces) must couple with a reference plane (GND or power); Hi-
speed busses should be referenced to the ground plane. In this case, if the designer needs to change the
ground reference, an adequate number of GND vias must be added in the area of transition to provide a
low impedance path between the two GND layers for the return current.
•
Hi-Speed busses are not allowed to change reference plane. If a reference plane change is unavoidable,
some capacitors should be added in the area to provide a low impedance return path through the
different reference planes.
•
Trace routing should keep a distance greater than 3w from the ground plane routing edge.
•
Power planes should keep a distance from the PCB edge sufficient to route a ground ring around the
PCB, the ground ring must then be connected to other layers through vias.
3.7
Module footprint and paste mask
The mechanical outline of the NINA-B1 series module can be found in the
NINA-B1 series Data Sheet
. The
proposed land pattern layout reflects the pads layout of the module.
The Non Solder Mask Defined (NSMD) pad type is recommended over the Solder Mask Defined (SMD) pad type,
which implements the solder mask opening 50
μ
m larger per side than the corresponding copper pad.
The suggested paste mask layout for the NINA-B1 series modules is to follow the copper mask layout as
described in
NINA-B1 series Data Sheet [2]
