EVA-M8M - Hardware Integration Manual
UBX-14006179 - R02
Early Production Information
Design-in
Page 21 of 45
2.11.1
Footprint
Figure 5: Recommended footprint (bottom view)
Units are in mm.
2.11.2
Paste mask
The paste mask
shall be 50 µm smaller than the copper pads with a paste thickness of 100 µm.
The paste mask outline needs to be considered when defining the minimal distance to the next
component.
These are recommendations only and not specifications. The exact geometry, distances, stencil thicknesses
and solder paste volumes must be adapted to the specific production processes (e.g. soldering etc.) of the
customer.
Pin1
Pin36
