EVA-M8M - Hardware Integration Manual
UBX-14006179 - R02
Early Production Information
Product
handling & soldering
Page 28 of 45
3.3.2
Reflow soldering
Preheat/ Soak Temperature min.
Preheat/ Soak Temperature max.
Preheat/ Soak Time from T
smin
to T
smax
T
smin
T
smax
T
s
(T
smin
to T
smax
)
150°C
180°C
< 90 seconds
Liquidus Temperature
Time maintained above T
L
T
L
t
L
217°C
40 to 60 seconds
Peak Package Body Temperature
T
P
250°C
Ramp up rate (T
L
to T
P
)
3°C/ second max.
Time 0°C…-5°C of T
P
30 seconds
Ramp down rate (T
P
to T
L
)
4°C/ second max.
Table 7: Recommended conditions for reflow process
The peak temperature must not exceed 250°C. The time above 245°C must not exceed 30 seconds.
EVA-M8M
must not
be soldered with a damp heat process.
3.3.3
Optical inspection
After soldering the EVA-M8M modules, consider an optical inspection step to check whether:
•
The module is properly aligned and centered over the pads
3.3.4
Repeated reflow soldering
Only single reflow soldering processes are recommended for boards populated with EVA-M8M modules.
3.3.5
Wave soldering
Base boards with combined through-hole technology (THT) components and surface-mount technology (SMT)
devices require wave soldering to solder the THT components. Only a single wave soldering process is
encouraged for boards populated with EVA-M8M.
3.3.6
Rework
Not recommended.
3.3.7
Conformal coating
Certain applications employ a conformal coating of the PCB using HumiSeal
®
or other related coating products.
Conformal Coating of the module will void the warranty.
3.3.8
Casting
If casting is required, use viscose or another type of silicon pottant. The OEM is strongly advised to qualify such
processes in combination with the EVA-M8M modules before implementing this in the production.
Casting will void the warranty.
3.3.9
Use of ultrasonic processes
Some components on the EVA-M8M modules are sensitive to Ultrasonic Waves. Use of any Ultrasonic Processes
(cleaning, welding etc.) may cause damage to the GNSS Receiver.
u-blox offers no warranty against damages to the EVA-M8M modules caused by any Ultrasonic Processes.
