2
Chapter 1: Overview
1.2
Features
Enclosure
• Industry 19” rack-mountable 1U
chassis
• Dimension:
D 25.4 x W 17.2 x H 1.72 inch
(645x436x43.6mm)
• Two nodes in one chassis
Processors (Per node)
• One LGA771 socket
• Supports Intel® 5100/5200/5400
processors
• Supports 1.33/ 1.06GHz FSB
Chipset (Per node)
• Intel® 5100 (San Clemente) North
Bridge
• Intel® ICH9-R South Bridge
• Winbond W83627DHG Super IO
Memory (Per node)
• Supports eight (8) 240-pin DDR2
DIMM sockets
• Maximum of 32GB DDR2-533/667
memory
• Supports Registered ECC DIMMs
Expansion Slots (Per node)
• One (1) x16 PCI-E with riser (pre-
installed)
• One (1) SO-DIMM connector for
IPMI 2.0 W/ KVM over IP (Optional)
Back I/O Ports (Per node)
• One stacked dual USB ports with
One RJ45 port (supports M3295-2/
M3296 IPMI from LAN)
• One stacked up LAN ports with dual
RJ45 connectors
• One 9-pin COM port
• One 15-pin VGA port
Front Panel Features (Per node)
• I/O
– (2) USB 2.0 ports
– (1) eSATA port (Optional)
• LED indicators
– Power LED
– (2) LAN LEDs
– ID LED
– HDD active LED
– Warning LED
• Switches
– Power
– Reset
– NMI
– ID
Storage (Per node)
• Hard Disk Drives:
– Serial ATA II Host controllers
embedded
– Supports (2) SATA/ SATA2 HDD
with RAID 0, 1
Networking (Per node)
• Tow LAN ports
• Dual Gigabit ports from Intel
82571EB
Video (Per node)
• XGI® Z9S, PCI graphics controller
• 32MB DDR2 frame buffer of video
memory
Drive Bay (Per node)
• Supports (2) 3.5” SATA Hot-swap
drive bays
Motherboard
• (2) TYAN S5377 customized
5.9”x13” board
BIOS
• AMI BIOS® on 8Mbit Flash ROM
• Supports ACPI 2.0
• Supports boot from USB device
• WOL and PXE support
• Power-on mode control for AC
power loss recovery
• PnP, DMI2.0, WfM2.0 Power man-
agement (S1, S4, S5 support)
• Serial Console Redirect
Server Management
• System fan speed monitoring and
control
• Supports Tyan Server Management
(TSM)
• Optional TYAN M3295-2/M3296
SMDC, IPMI 2.0 compliant
