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4.5 Thermal Interface Material
There are two types of
thermal interface materials
designed for use with the
processors.
The most common material
comes as a small pad
attached to the heat sink at
the time of purchase. There
should be a protective cover
over the material. Take care
not to touch this material.
Simply remove the protective
cover and place the heat sink
on the processor.
The second type of interface
material is usually packaged
separately. It is commonly
referred to as ‘thermal
compound’. Simply apply a
thin layer on to the CPU lid
(applying too much will
actually reduce the cooling).
NOTE:
Always check with the manufacturer of the heat sink & processor to
ensure that the thermal interface material is compatible with the processor and
meets the manufacturer’s warranty requirements.
Summary of Contents for FS65-B5521
Page 1: ...1 http www tyan com FS65 B5521 MicroServer Series Service Engineer s Manual ...
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Page 16: ...http www tyan com 16 NOTE ...
Page 32: ...http www tyan com 32 Storage Blade Block Diagram ...
Page 36: ...http www tyan com 36 2 Unscrew the HDD tray to take out the HDD cage ...
Page 49: ...http www tyan com 49 4 Screw the chassis to the rack 5 Insert the blades into the chassis ...
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Page 75: ...http www tyan com 75 4 2 Block Diagram S5521 Block Diagram ...
Page 76: ...http www tyan com 76 4 3 Mainboard Mechanical Drawing ...
Page 78: ...http www tyan com 78 JP2 JP1 ...
Page 92: ...http www tyan com 92 S3 Video Repost Enable or disable S3 Video Repost Disabled Enabled ...
Page 102: ...http www tyan com 102 NOTE SDR can not be modified Read only ...
Page 114: ...http www tyan com 114 Boot Option 1 Select the first boot device Device Name Disabled ...
Page 119: ...http www tyan com 119 5 8 Event Logs Read only ...
Page 122: ...http www tyan com 122 NOTE ...
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