FDX3543RP
-20-
15. Stop Operation
A limited operating life and the possibility of random failures are inherent to FPI and shall be
taken into account for the protection of personnel and equipment. The operation of FPI under
inappropriate conditions, either due to the lack of care or knowledge, can lead to grave risk to
the life and limb of personnel, independent of the risk of FPI and/or equipment damage.
16. Mechanical Shock and Vibration
Do not give a mechanical shock or vibration to the FPI housing. It may cause the malfunction of
FPI due to break down of TFT panel.
17. Protection of Input Plate
The FPI input plate consists of a thin carbon plate (CFRP). Therefore it shall never receive
shock or pressure.
18. Environmental Temperature, Humidity and Atmosphere (Electromagnetic Waves)
The specified temperature and humidity in operating and storage are described at the technical
data sheet and the specification. Moreover, FPI shall not experience large and fast temperature
and humidity change. Do not use and set the FPI in an atmosphere of inflammable and/or
corrosion gasses.
Do not install FPI at around any electromagnetic wave noise sources.
19. Condensation
Do not let FPI in condensation situation at any time. It may cause malfunctions of electronics
circuit and deterioration of images.
20. Dust and Particles
Do not use FPI in the environment where dust and particles exist.
21. Power Supply
(1) Use the Interface Box attached to FPI.
(2) Do not remodel the power supply. Use the power supply as delivered.
22. Adjustment
The FPI requires adjustment (ex. Gain and image processing calibrations) according to input
X-ray conditions. Be sure to start using the FPI with equipment after adjustment. In the case of
exchanging X-ray tube assembly or change of X-ray intensity distribution, adjustment of the FPI
is necessary.
23. Memory
A memory chip is mounted on this device. The memory contents may be cleared due to
electrical shock as ESD, Donot apply major stress such as ESD.
24. Environment Temperature
Use the FPI under specified temperature conditions. This is in order to prevent deterioration of
FPI characteristics and the cause of malfunctions due to lowering cooling availability.
