Toshiba D-R560KU, Service Manual

Page: 10 / 72

1-4-3 DVDN_SN
With Iron Wire:
1. Using desoldering braid, remove the solder from
all pins of the flat pack-IC. When you use solder
flux which is applied to all pins of the flat pack-IC,
you can remove it easily. (Fig. S-1-3)
2. Affix the wire to a workbench or solid mounting
point, as shown in Fig. S-1-5.
3. While heating the pins using a fine tip soldering
iron or hot air blower, pull up the wire as the solder
melts so as to lift the IC leads from the BOARD
contact pads as shown in Fig. S-1-5.
4. Bottom of the flat pack-IC is fixed with glue to the
BOARD; when removing entire flat pack-IC, first
apply soldering iron to center of the flat pack-IC
and heat up. Then remove (glue will be melted).
(Fig. S-1-6)
5. Release the flat pack-IC from the BOARD using
tweezers. (Fig. S-1-6)
Note: When using a soldering iron, care must be
taken to ensure that the flat pack-IC is not
being held by glue. When the flat pack-IC is
removed from the BOARD, handle it gently
because it may be damaged if force is applied.
2. Installation
1. Using desoldering braid, remove the solder from
the foil of each pin of the flat pack-IC on the
BOARD so you can install a replacement flat pack-
IC more easily.
2. The “
●
” mark on the flat pack-IC indicates pin 1.
(See Fig. S-1-7.) Be sure this mark matches the 1
on the BOARD when positioning for installation.
Then presolder the four corners of the flat pack-IC.
(See Fig. S-1-8.)
3. Solder all pins of the flat pack-IC. Be sure that
none of the pins have solder bridges.
To Solid
Mounting Point
Soldering Iron
Iron Wire
or
Hot Air Blower
Fig. S-1-5
Fine Tip
Soldering Iron
BOARD
Flat Pack-IC
Tweezers
Fig. S-1-6
Example :
Pin 1 of the Flat Pack-IC
is indicated by a " " mark.
Fig. S-1-7
Presolder
BOARD
Flat Pack-IC
Fig. S-1-8