www.ti.com
6.2
Bill of Materials
Schematic and Bill of Materials
Table 2. TPS6227XEVM-306 Bill of Materials
(1) (2) (3) (4)
Referen
ce
Count
Value
Description
Size
Part Number
MFR
Descrip
tion
Capacitor, Ceramic, 6.3 V,
2
C1, C2
10
µ
F
0603
GRM188R60J106ME47D
muRata
X5R, 20%
J1, J2,
Header, 2 pin, 100 mil spacing,
4
PTC36SAAN
0.100 x 2
PTC36SAAN
Sullins
J3, J4
(36-pin strip)
JP1,
Header, 3 pin, 100mil spacing,
2
PTC36SAAN
0.100 x 3
PTC36SAAN
Sullins
JP2
(36-pin strip)
1
L1
2.2
µ
H
Inductor, SMT, 1.5 A, 110 m
Ω
0.118 x 0.118 inch
LPS3010-222ML
Coilcraft
IC, 2.25 MHz 400 mA
1
U1
TPS62270DRV Step-Down
SON-6[DRV]
TPS62270DRV
TI
Converter w/ selectable VOUT
2
—
—
Shunt, 100-mil, Black
0.1
929950-00
3M
1
—
—
PCB
1.50 x 1.50 inch
HPA306
ANY
(1)
These assemblies are ESD sensitive, ESD precautions shall be observed.
(2)
These assemblies must be clean and free from flux and all contaminants. Use of no clean flux is not acceptable.
(3)
These assemblies must comply with workmanship standards IPC-A-610 Class 2.
(4)
Reference designators marked with an asterisk ('**') cannot be substituted. All other components can be substituted with
equivalent manufacturer's components.
SLVU234 – February 2008
TPS6227xEVM-306
9