TPA6120A2 EVM Bottom Layer
4-3
EVM Circuit and Layout
4.2
TPA6120A2 EVM Bottom Layer
Figure 4−2 shows the bottom layer of the TPA6120A2 EVM. Note that the
copper has been removed from around the capacitive sensitive nodes. It is
important to remember that the thermal pad on the underside of the IC must
be properly soldered to the board at all times.
Figure 4−2. Bottom Layer of the TPA6120A2 EVM
