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EXAMPLE BOARD LAYOUT
(5.8)
0.05 MAX
ALL AROUND
0.05 MIN
ALL AROUND
24X (1.5)
24X (0.45)
22X (0.65)
(3.4)
NOTE 9
(7.8)
NOTE 9
(2.4)
(5.16)
(
) TYP
VIA
0.2
(1) TYP
(1.1)
TYP
(R
)
TYP
0.05
4222709/A 02/2016
PowerPAD TSSOP - 1.2 mm max height
PWP0024B
PLASTIC SMALL OUTLINE
SYMM
SYMM
SEE DETAILS
LAND PATTERN EXAMPLE
SCALE:10X
1
12
13
24
METAL COVERED
BY SOLDER MASK
SOLDER MASK
DEFINED PAD
TM
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
8. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature
numbers SLMA002 (www.ti.com/lit/slma002) and SLMA004 (www.ti.com/lit/slma004).
9. Size of metal pad may vary due to creepage requirement.
METAL
SOLDER MASK
OPENING
NON SOLDER MASK
DEFINED
SOLDER MASK DETAILS
PADS 1-24
SOLDER MASK
DEFINED
SOLDER MASK
METAL UNDER
SOLDER MASK
OPENING