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PACKAGE OUTLINE
C
TYP
6.6
6.2
22X 0.65
24X 0.30
0.19
2X
7.15
(0.15) TYP
0 - 8
0.15
0.05
2.40
1.65
5.16
4.12
2X (0.95) MAX
NOTE 5
1.2 MAX
(1)
0.25
GAGE PLANE
0.75
0.50
A
NOTE 3
7.9
7.7
B
4.5
4.3
4X (0.2) MAX
NOTE 5
4222709/A 02/2016
PowerPAD TSSOP - 1.2 mm max height
PWP0024B
PLASTIC SMALL OUTLINE
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm per side.
4. Reference JEDEC registration MO-153.
5. Features may not be present and may vary.
PowerPAD is a trademark of Texas Instruments.
TM
1
24
0.1
C A
B
13
12
PIN 1 ID
AREA
SEATING PLANE
0.1 C
SEE DETAIL A
DETAIL A
TYPICAL
SCALE 2.200
EXPOSED
THERMAL PAD